18025018. PLASMA PROCESSING APPARATUS simplified abstract (HITACHI HIGH-TECH CORPORATION)
Contents
PLASMA PROCESSING APPARATUS
Organization Name
Inventor(s)
Shintarou Nakatani of Tokyo (JP)
Kazunori Nakamoto of Tokyo (JP)
PLASMA PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18025018 titled 'PLASMA PROCESSING APPARATUS
The abstract describes an electrostatic chuck with heaters covered by dielectric films. The heaters are divided into different regions, each with a specific shape in plan view. These regions are electrically connected to a control unit that can individually control the power supply to each region.
- The electrostatic chuck has heaters covered by dielectric films.
- The heaters are divided into different regions with specific shapes in plan view.
- The regions are electrically connected to a control unit for individual power control.
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Wafer bonding
Problems Solved: - Uniform heating of substrates - Precise temperature control - Enhanced process efficiency
Benefits: - Improved thermal performance - Increased process repeatability - Energy efficiency
Commercial Applications: Title: Advanced Electrostatic Chuck for Semiconductor Manufacturing This technology can be used in semiconductor fabrication facilities to enhance process control and efficiency, leading to higher quality products and increased productivity.
Questions about the technology: 1. How does the individual control of power to different regions of the heater improve the performance of the electrostatic chuck? 2. What are the specific advantages of using dielectric films to cover the heaters in this electrostatic chuck design?
Original Abstract Submitted
An electrostatic chuck has a heater HT and a heater HT each covered by dielectric films to . The heater HT is divided into a region HThaving a circular shape in plan view, a region HTsurrounding an outer periphery of the region HTin plan view, and a region HTsurrounding an outer periphery of the region HTin plan view. The heater HT is divided into a plurality of regions HT, each having a rectangular shape in plan view. The regions HTto HTand the plurality of regions HTare electrically connected to a control unit C. The control unit C is configured to individually control supply of power to the regions HTto HTand the plurality of regions HT
