18022418. DISPLAY MODULE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE simplified abstract (BOE Technology Group Co., Ltd.)
Contents
DISPLAY MODULE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE
Organization Name
BOE Technology Group Co., Ltd.
Inventor(s)
DISPLAY MODULE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18022418 titled 'DISPLAY MODULE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE
Simplified Explanation: The patent application describes a display module with specific bonding regions on a circuit board and display substrate, connected via suspended wires.
Key Features and Innovation:
- Display module with distinct bonding regions on circuit board and display substrate.
- Multiple circuit board pads arranged in rows for bonding to substrate pads.
- Orthographic projection ensures no overlap between bonding regions.
- Suspended wires used for bonding circuit board pads to substrate pads.
Potential Applications: The technology could be used in various display devices such as smartphones, tablets, and monitors.
Problems Solved: The technology addresses the need for efficient and reliable bonding between circuit boards and display substrates in electronic devices.
Benefits:
- Improved connectivity between circuit boards and display substrates.
- Enhanced durability and performance of display modules.
- Simplified manufacturing process for display devices.
Commercial Applications: Potential commercial applications include consumer electronics manufacturing companies looking to enhance the quality and performance of their display devices.
Prior Art: Readers can start their search for prior art related to this technology by exploring patents in the field of display module manufacturing and electronic device assembly.
Frequently Updated Research: Stay updated on advancements in display module technology and manufacturing processes to leverage the latest innovations in the field.
Questions about Display Module Technology: 1. What are the key advantages of using suspended wires for bonding circuit board pads to substrate pads? 2. How does the specific arrangement of circuit board pads and substrate pads contribute to the efficiency of the display module?
Original Abstract Submitted
A display module, a method for manufacturing the same, and a display device. The display module includes: a first bonding region of a circuit board is provided with a first row of circuit board pads and a second row of circuit board pads, and each row of circuit board pads comprises multiple circuit board pads arranged at intervals in a first direction; a second bonding region of the display substrate is provided with a plurality of substrate pads arranged in the first direction, an orthographic projection of the display substrate onto the circuit board does not overlap the first bonding region, and the second bonding region is close to the first bonding region. The circuit board pads are bonded to the substrate pads via suspended wires. The second row of circuit board pads comprises first circuit board pads and second circuit board pads.
