18018176. SEMICONDUCTOR PACKAGE AND HIGH FREQUENCY MODULE simplified abstract (Fujikura Ltd.)
Contents
SEMICONDUCTOR PACKAGE AND HIGH FREQUENCY MODULE
Organization Name
Inventor(s)
Michikazu Tomita of Sakura-shi (JP)
SEMICONDUCTOR PACKAGE AND HIGH FREQUENCY MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18018176 titled 'SEMICONDUCTOR PACKAGE AND HIGH FREQUENCY MODULE
The semiconductor package described in the patent application includes an RFIC chip, a mold resin surrounding the RFIC chip, solder bumps, and redistributors connecting the RFIC chip to the solder bumps.
- The solder bumps are divided into two groups: a first group overlapping with the RFIC chip and a second group overlapping with the mold resin in a planar view.
- The second bump group includes a high frequency bump connected to a high frequency terminal of the RFIC chip, and a GND bump connected to a GND terminal of the RFIC chip.
- The minimum pitch in the second bump group is larger than the minimum pitch in the first bump group.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor packages for high-frequency applications. - It can improve the performance and reliability of RFIC chips in various wireless communication devices.
Problems Solved: - Enhances the connectivity and signal integrity of RFIC chips in semiconductor packages. - Optimizes the layout and design of solder bumps for improved high-frequency performance.
Benefits: - Increased efficiency and performance of RFIC chips in high-frequency applications. - Enhanced reliability and signal integrity in semiconductor packages.
Commercial Applications: - This technology can be applied in the production of 5G communication devices, radar systems, and satellite communication equipment.
Questions about the Technology: 1. How does the larger minimum pitch in the second bump group contribute to the performance of the RFIC chip? 2. What are the specific challenges in designing solder bumps for high-frequency applications?
Frequently Updated Research: - Stay updated on the latest advancements in semiconductor packaging technology for high-frequency applications to ensure optimal performance and reliability.
Original Abstract Submitted
A semiconductor package includes an RFIC chip, a mold resin that surrounds the RFIC chip in a planar view, a plurality of solder bumps, and a plurality of redistributors that connect the RFIC chip to the plurality of solder bumps, wherein a first bump group disposed in a position that overlaps with the RFIC chip in the planar view, and a second bump group disposed in a position that overlaps with the mold resin in the planar view are included in the plurality of solder bumps, in the second bump group, at least a high frequency bump connected to a high frequency terminal of the RFIC chip, and a GND bump connected to a GND terminal of the RFIC chip are included, and a minimum pitch in the second bump group is larger than a minimum pitch in the first bump group.
