18005745. Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device simplified abstract (Honor Device Co., Ltd.)
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Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device
Organization Name
Inventor(s)
Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device - A simplified explanation of the abstract
This abstract first appeared for US patent application 18005745 titled 'Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device
The patent application describes a method for surface treatment, a package substrate, and an electronic device.
- The package substrate contains a dielectric material layer with resin and spherical SiO filled in the resin.
- A sacrificial layer covers the outer surface of the spherical SiO, which is then treated to reduce its volume, creating a cavity around the spherical SiO.
- This cavity allows a metal layer to enter and form a new anchor point between the spherical SiO and surrounding resin.
Potential Applications: - This technology could be used in the manufacturing of electronic devices such as integrated circuits and semiconductor packages.
Problems Solved: - The innovation addresses the need for improved adhesion between different materials in electronic components.
Benefits: - Enhanced reliability and performance of electronic devices. - Increased durability and longevity of package substrates.
Commercial Applications: - This technology could be valuable in the semiconductor industry for improving the quality and reliability of electronic components.
Prior Art: - Researchers interested in this technology may want to explore prior patents related to surface treatment methods in electronic packaging.
Frequently Updated Research: - Stay informed about advancements in dielectric materials and surface treatment techniques for electronic devices.
Questions about the Technology: 1. How does the sacrificial layer contribute to the adhesion between the spherical SiO and surrounding resin? 2. What are the potential challenges in scaling up this surface treatment method for mass production?
Original Abstract Submitted
Disclosed in this application are a surface treatment method, a package substrate, and an electronic device. The package substrate comprises a dielectric material layer. The dielectric material layer includes resin and spherical SiOfilled in the resin. An outer surface of at least part of the spherical SiOis covered with a sacrificial layer. The sacrificial layer covering the outer surface of the spherical SiOis treated, to reduce the volume of the sacrificial layer covering the outer surface of the spherical SiO, so that a cavity is formed around the spherical SiOor part of the spherical SiOis disengaged from the dielectric material layer. In this way, a metal layer may enter the cavity around the spherical SiOand form a new anchor point between the spherical SiOand surrounding resin.
