17994446. SENSOR PACKAGE WITH LOW ASPECT RATIO THROUGH SILICON VIA simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
Contents
- 1 SENSOR PACKAGE WITH LOW ASPECT RATIO THROUGH SILICON VIA
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SENSOR PACKAGE WITH LOW ASPECT RATIO THROUGH SILICON VIA - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SENSOR PACKAGE WITH LOW ASPECT RATIO THROUGH SILICON VIA
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Masamitsu Matsuura of Oita (JP)
SENSOR PACKAGE WITH LOW ASPECT RATIO THROUGH SILICON VIA - A simplified explanation of the abstract
This abstract first appeared for US patent application 17994446 titled 'SENSOR PACKAGE WITH LOW ASPECT RATIO THROUGH SILICON VIA
Simplified Explanation
The electronic device described in the patent application includes a semiconductor substrate with a conductive routing structure, a via opening extending through the substrate, a transparent cover, an insulator layer with a photo-imageable material, and a second conductive routing structure.
- Semiconductor substrate with a first conductive routing structure on one side
- Low aspect ratio via opening extending through the substrate
- Transparent cover over a portion of the substrate
- Insulator layer with photo-imageable material on the opposite side and along the via opening
- Second conductive routing structure on the outer side of the insulator layer, directly contacting the first conductive routing structure
Potential Applications
This technology could be applied in:
- Transparent electronic devices
- Wearable technology
- Flexible displays
Problems Solved
This technology helps in:
- Improving transparency of electronic devices
- Enhancing connectivity in compact devices
- Facilitating the integration of multiple components in a small space
Benefits
The benefits of this technology include:
- Improved aesthetics of electronic devices
- Enhanced functionality in a compact form factor
- Increased durability and reliability of electronic components
Potential Commercial Applications
This technology could be commercially benefit:
- Consumer electronics industry
- Medical devices sector
- Automotive technology market
Possible Prior Art
One possible prior art for this technology could be the use of transparent conductive materials in electronic devices to improve visibility and aesthetics.
Unanswered Questions
How does this technology impact the overall cost of electronic devices?
The article does not provide information on the cost implications of implementing this technology in electronic devices.
What are the environmental implications of using photo-imageable materials in the manufacturing process?
The article does not address the potential environmental impact of using photo-imageable materials in the production of electronic devices.
Original Abstract Submitted
An electronic device includes a semiconductor substrate having a first conductive routing structure on a first side of the semiconductor substrate, and a low aspect ratio via opening extending from the first side to an opposite second side. The electronic device includes a transparent cover over a portion of the first side and covering the patterned first conductive routing structure, as well as an insulator layer including a photo-imageable material on the second side and along a sidewall of the via opening, and a second conductive routing structure on an outer side of the insulator layer and extending through the via opening and directly contacting a portion of the first conductive routing structure.
