17993240. Socket To Support High Performance Multi-die ASICs simplified abstract (Google LLC)
Contents
- 1 Socket To Support High Performance Multi-die ASICs
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Socket To Support High Performance Multi-die ASICs - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
Socket To Support High Performance Multi-die ASICs
Organization Name
Inventor(s)
Nam Hoon Kim of San Jose CA (US)
Jaesik Lee of San Jose CA (US)
Woon-Seong Kwon of Santa Clara CA (US)
Teckgyu Kang of Saratoga CA (US)
Socket To Support High Performance Multi-die ASICs - A simplified explanation of the abstract
This abstract first appeared for US patent application 17993240 titled 'Socket To Support High Performance Multi-die ASICs
Simplified Explanation
The abstract describes a microelectronic system with a socket mounted to a microelectronic component, containing ground shielded coaxial socket pins for connecting microelectronic elements with active semiconductor devices.
- The microelectronic system includes a microelectronic component with exposed electrically conductive elements, a socket with a substrate embedded in it, microelectronic elements with active semiconductor devices and element contacts, and ground shielded coaxial socket pins for connection.
- The microelectronic elements may be partially within a recess in the socket, and the element contacts are pressed into contact with a land grid array on the socket.
Potential Applications
The technology described in the patent application could be applied in various fields such as:
- Microelectronics
- Semiconductor industry
- Electronic manufacturing
Problems Solved
The technology addresses the following issues:
- Secure and reliable connection between microelectronic components
- Efficient transmission of electrical signals
- Protection against electromagnetic interference
Benefits
The technology offers the following benefits:
- Improved performance of microelectronic systems
- Enhanced durability and longevity of connections
- Reduction in signal interference
Potential Commercial Applications
The technology could be utilized in commercial applications such as:
- Consumer electronics
- Telecommunications equipment
- Industrial automation systems
Possible Prior Art
One possible prior art for this technology could be the use of traditional socket pins for connecting microelectronic components.
Unanswered Questions
How does this technology compare to existing socket pin designs in terms of signal transmission efficiency?
The article does not provide a direct comparison between this technology and existing socket pin designs in terms of signal transmission efficiency. Further research or testing may be needed to evaluate this aspect.
What are the potential challenges in implementing this technology in mass production of microelectronic systems?
The article does not address the potential challenges in implementing this technology in mass production of microelectronic systems. Factors such as cost, scalability, and compatibility with existing manufacturing processes could be important considerations.
Original Abstract Submitted
A microelectronic system may include a microelectronic component having electrically conductive elements exposed at a first surface thereof, a socket mounted to a first surface of the microelectronic component and including a substrate embedded therein, one or more microelectronic elements each having active semiconductor devices therein and each having element contacts exposed at a front face thereof, and a plurality of socket pins mounted to and extending above the substrate, the socket pins being ground shielded coaxial socket pins. The one or more microelectronic elements may be disposed at least partially within a recess defined within the socket. The socket may have a land grid array comprising top surfaces of the plurality of the socket pins or electrically conductive pads mounted to corresponding ones of the socket pins, and the element contacts of the one or more microelectronic elements may be pressed into contact with the land grid array.
