17988642. PACKAGE SUBSTRATE AND/OR A BOARD WITH A SHARED POWER DISTRIBUTION NETWORK simplified abstract (QUALCOMM Incorporated)
Contents
- 1 PACKAGE SUBSTRATE AND/OR A BOARD WITH A SHARED POWER DISTRIBUTION NETWORK
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGE SUBSTRATE AND/OR A BOARD WITH A SHARED POWER DISTRIBUTION NETWORK - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PACKAGE SUBSTRATE AND/OR A BOARD WITH A SHARED POWER DISTRIBUTION NETWORK
Organization Name
Inventor(s)
Jason Gonzalez of Solana Beach CA (US)
PACKAGE SUBSTRATE AND/OR A BOARD WITH A SHARED POWER DISTRIBUTION NETWORK - A simplified explanation of the abstract
This abstract first appeared for US patent application 17988642 titled 'PACKAGE SUBSTRATE AND/OR A BOARD WITH A SHARED POWER DISTRIBUTION NETWORK
Simplified Explanation
The abstract describes a device with integrated devices, passive devices, and interconnects, including a power interconnect, all coupled to a substrate. The interconnects operate as an inductor, with a via interconnect included.
- The device includes a substrate with integrated devices, passive devices, and interconnects.
- A power interconnect is present, electrically coupled to power.
- The interconnects function as an inductor, with a via interconnect included.
Potential Applications
This technology could be applied in:
- Power electronics
- Circuit design
- Integrated circuits
Problems Solved
This technology helps in:
- Efficient power distribution
- Compact device design
- Improved circuit performance
Benefits
The benefits of this technology include:
- Enhanced power management
- Space-saving design
- Higher circuit efficiency
Potential Commercial Applications
A potential commercial application for this technology could be:
- Power supply units for electronic devices
Possible Prior Art
One possible prior art for this technology could be:
- Integrated circuit designs with interconnects functioning as inductors
Unanswered Questions
1. How does the power interconnect enhance the overall performance of the device? 2. What specific types of integrated devices are coupled to the substrate in this device?
Original Abstract Submitted
A device comprising a substrate, a first integrated device coupled to a first surface of the substrate, a second integrated device coupled to the first surface of the substrate, a first passive device coupled to a second surface of the substrate and a second passive device coupled to the second surface of the substrate. The substrate comprises at least one dielectric layer and a plurality of interconnects. The plurality of interconnects include a power interconnect. The power interconnect is configured to be electrically coupled to power. The first integrated device, the first passive device, the second integrated device and the second passive device are configured to be electrically coupled to the power interconnect through a first plurality of interconnects from the plurality of interconnects. The first plurality of interconnects are configured to operate as an inductor, where the first plurality of interconnects include a via interconnect.
