17988083. METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE simplified abstract (Applied Materials, Inc.)
Contents
- 1 METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
Organization Name
Inventor(s)
Yue Guo of Redwood City CA (US)
Kartik Ramaswamy of San Jose CA (US)
Yang Yang of Cupertino CA (US)
Nicolas John Bright of Mountain Lakes NJ (US)
A N M Wasekul Azad of Cupertino CA (US)
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17988083 titled 'METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
Simplified Explanation
The abstract describes methods and apparatus for processing a substrate using a matching network that includes sensors, a variable capacitor, and a controller to tune the network based on impedance measurements during RF generator pulse on time.
- The matching network includes sensors, a variable capacitor, and a controller.
- The sensors measure impedance during RF generator pulse on time.
- The variable capacitor is tuned by the controller based on impedance values measured during pulse on or pulse off states.
- The technology is used to optimize substrate processing in a plasma processing chamber.
Potential Applications
The technology can be applied in semiconductor manufacturing, thin film deposition, and other industries requiring precise substrate processing.
Problems Solved
This technology solves the problem of inefficient substrate processing due to impedance mismatches in the RF power delivery system.
Benefits
The benefits of this technology include improved process control, increased substrate yield, and enhanced overall efficiency in substrate processing.
Potential Commercial Applications
Potential commercial applications of this technology include semiconductor fabrication equipment, plasma etching systems, and other substrate processing machinery.
Possible Prior Art
One possible prior art for this technology could be existing matching networks used in RF power delivery systems for substrate processing.
Unanswered Questions
How does this technology compare to traditional matching networks in terms of efficiency and accuracy?
This article does not provide a direct comparison between this technology and traditional matching networks in terms of efficiency and accuracy.
What are the potential limitations or challenges in implementing this technology in industrial-scale substrate processing systems?
The article does not address the potential limitations or challenges in implementing this technology in industrial-scale substrate processing systems.
Original Abstract Submitted
Methods and apparatus for processing a substrate are provided herein. For example, a matching network comprises a first sensor operably connected to an input of the matching network and an RF generator operable at a first frequency and a second sensor operably connected to an output of the matching network and the plasma processing chamber. The first sensor and the second sensor are configured to measure impedance during an RF generator pulse on time. A variable capacitor is connected to the first sensor and the second sensor, and a controller is configured to tune the at least one variable capacitor of the matching network during the RF generator pulse on time based on impedance values measured during at least one of pulse on states or pulse off states of a pulse voltage waveform generator connected to the matching network or an RF signal of another RF generator operable at a second frequency different from the first frequency.
