17988051. BUMPLESS HYBRID ORGANIC GLASS INTERPOSER simplified abstract (Intel Corporation)
Contents
- 1 BUMPLESS HYBRID ORGANIC GLASS INTERPOSER
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 BUMPLESS HYBRID ORGANIC GLASS INTERPOSER - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
BUMPLESS HYBRID ORGANIC GLASS INTERPOSER
Organization Name
Inventor(s)
Jeremy D. Ecton of Gilbert AZ (US)
Brandon Christian Marin of Gilbert AZ (US)
Aleksandar Aleksov of Chandler AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Haobo Chen of Chandler AZ (US)
BUMPLESS HYBRID ORGANIC GLASS INTERPOSER - A simplified explanation of the abstract
This abstract first appeared for US patent application 17988051 titled 'BUMPLESS HYBRID ORGANIC GLASS INTERPOSER
Simplified Explanation
The abstract describes a patent application for a bumpless hybrid organic glass interposer that utilizes high density pattern (HDP) routing layers to achieve electrical connections between layers.
- High density pattern (HDP) routing layers are placed on a separate carrier from the organic substrate package.
- The HDP layers are attached to the substrate package.
- Electrical connections are achieved through a self-align dry etch process via landing pads connected to the HDP routing.
Potential Applications
The technology could be applied in various electronic devices such as smartphones, tablets, and computers to improve signal transmission and reduce interference.
Problems Solved
This technology solves the problem of achieving reliable electrical connections between layers in electronic devices without the need for traditional bump structures.
Benefits
The bumpless hybrid organic glass interposer offers improved signal integrity, reduced signal loss, and increased reliability in electronic devices.
Potential Commercial Applications
The technology could be used in the manufacturing of high-performance electronic devices, leading to improved product quality and performance.
Possible Prior Art
One possible prior art could be the use of traditional bump structures for achieving electrical connections between layers in electronic devices.
Unanswered Questions
How does the bumpless hybrid organic glass interposer compare to traditional bump structures in terms of performance and reliability?
The article does not provide a direct comparison between the bumpless hybrid organic glass interposer and traditional bump structures in terms of performance and reliability.
What are the potential challenges in implementing the bumpless hybrid organic glass interposer technology in mass production?
The article does not address the potential challenges in implementing the bumpless hybrid organic glass interposer technology in mass production, such as cost-effectiveness and scalability.
Original Abstract Submitted
A bumpless hybrid organic glass interposer. One or more high density pattern (HDP) routing layers are placed on a functional, thin, carrier, separate from the intended organic substrate patch or package. The HDP layer(s) is/are then attached to the substrate package. The interposers achieve electrical connections between the HDP layer and underlying routing layer of the substrate package by utilizing a self-align dry etch process through landing pads connected to the HDP routing.
