17987679. ADDITION OF EXTERNAL ULTRAVIOLET LIGHT FOR IMPROVED PLASMA STRIKE CONSISTENCY simplified abstract (Applied Materials, Inc.)
Contents
- 1 ADDITION OF EXTERNAL ULTRAVIOLET LIGHT FOR IMPROVED PLASMA STRIKE CONSISTENCY
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ADDITION OF EXTERNAL ULTRAVIOLET LIGHT FOR IMPROVED PLASMA STRIKE CONSISTENCY - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
ADDITION OF EXTERNAL ULTRAVIOLET LIGHT FOR IMPROVED PLASMA STRIKE CONSISTENCY
Organization Name
Inventor(s)
Eric Kihara Shono of San Mateo CA (US)
Vladimir Nagorny of Tracy CA (US)
Rene George of San Carlos CA (US)
Vilen K. Nestorov of Pleasanton CA (US)
Martin John Ripley of San Jose CA (US)
Christopher S. Olsen of Fremont CA (US)
ADDITION OF EXTERNAL ULTRAVIOLET LIGHT FOR IMPROVED PLASMA STRIKE CONSISTENCY - A simplified explanation of the abstract
This abstract first appeared for US patent application 17987679 titled 'ADDITION OF EXTERNAL ULTRAVIOLET LIGHT FOR IMPROVED PLASMA STRIKE CONSISTENCY
Simplified Explanation
Embodiments of the present disclosure relate to methods and apparatuses of processing a substrate. The apparatus includes a process chamber, a substrate support, and a remote plasma source. The substrate support is configured to support a substrate within the processing region. The remote plasma source is coupled to the chamber body through a connector. The remote plasma source includes a body, an inlet, an inductive coil, and one or more UV sources.
- The apparatus includes a process chamber, substrate support, and remote plasma source.
- The substrate support holds the substrate during processing.
- The remote plasma source is connected to the chamber body and includes an inductive coil and UV sources.
Potential Applications
This technology could be used in semiconductor manufacturing, thin film deposition, and surface treatment processes.
Problems Solved
This technology helps improve uniformity and efficiency in substrate processing, leading to better quality end products.
Benefits
The benefits of this technology include enhanced process control, increased productivity, and improved overall performance of the substrate processing system.
Potential Commercial Applications
Potential commercial applications of this technology include semiconductor fabrication facilities, research institutions, and industrial manufacturing plants.
Possible Prior Art
One possible prior art for this technology could be similar plasma processing systems used in the semiconductor industry.
Unanswered Questions
1. How does the remote plasma source improve the processing of the substrate? 2. What specific gases are introduced into the body of the remote plasma source and how do they affect the processing of the substrate?
Original Abstract Submitted
Embodiments of the present disclosure relate to methods and apparatuses of processing a substrate. The apparatus includes a process chamber, the process chamber including a chamber body, a substrate support, and a remote plasma source. The substrate support is configured to support a substrate within the processing region. The remote plasma source is coupled to the chamber body through a connector. The remote plasma source includes a body, an inlet, an inductive coil, and one or more UV sources. The body has a first end, a second end, and a tube spanning between the first end and the second end. The inlet is coupled to a gas source configured to introduce one or more gases into the body through the first end of the body. The inductive coil loops around the tube. The one or more UV sources are coupled to the first end of the body.
