17972321. ELECTRONIC DEVICE HOUSING AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
ELECTRONIC DEVICE HOUSING AND ELECTRONIC DEVICE INCLUDING THE SAME
Organization Name
Inventor(s)
Hyunjung Jung of Suwon-si (KR)
Hyeonseok Yoon of Suwon-si (KR)
ELECTRONIC DEVICE HOUSING AND ELECTRONIC DEVICE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17972321 titled 'ELECTRONIC DEVICE HOUSING AND ELECTRONIC DEVICE INCLUDING THE SAME
Simplified Explanation
The abstract describes an electronic device housing that includes multiple layers to protect the instrument inside.
- The housing consists of an instrument, a first primer layer, a film layer, a second primer layer, and a coating layer.
- The film layer has at least one overwrap that surrounds the first primer layer.
- The layers provide additional protection to the instrument and enhance the durability of the housing.
Potential Applications
This technology can be applied in various electronic devices that require protective housing, such as:
- Smartphones
- Tablets
- Laptops
- Wearable devices
- Gaming consoles
Problems Solved
The technology addresses the following problems:
- Vulnerability of electronic devices to physical damage
- Wear and tear caused by daily usage
- Scratches, impacts, and other external factors that can harm the device
Benefits
The benefits of this technology include:
- Enhanced protection for the instrument inside the housing
- Improved durability and longevity of the electronic device
- Reduction in physical damage caused by daily usage
- Prevention of scratches, impacts, and other external factors that can harm the device
Original Abstract Submitted
An electronic device housing includes an instrument, a first primer layer provided to cover the instrument, a film layer provided on the first primer layer, a second primer layer provided on the film layer, and a coating layer provided on the second primer layer. The film layer includes at least one overwrap at which the film layer overlaps that is configured to surround the first primer layer.
