17971394. RESONANT ANTENNA FOR PHYSICAL VAPOR DEPOSITION APPLICATIONS simplified abstract (Tokyo Electron Limited)
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RESONANT ANTENNA FOR PHYSICAL VAPOR DEPOSITION APPLICATIONS
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RESONANT ANTENNA FOR PHYSICAL VAPOR DEPOSITION APPLICATIONS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17971394 titled 'RESONANT ANTENNA FOR PHYSICAL VAPOR DEPOSITION APPLICATIONS
The patent application describes a system and method for efficiently generating high-density plasma for physical vapor deposition (PVD) processes.
- The system includes a vacuum chamber for the PVD process, with a target for sputtering material onto a wafer.
- A resonant structure, formed by an antenna and capacitors, provides a pulsed output at a resonant frequency.
- The resonant structure generates a plasma between the target and the wafer to ionize the sputtered material.
- This innovation aims to improve the efficiency and effectiveness of PVD processes by enhancing plasma generation.
Potential Applications: - Semiconductor manufacturing - Thin film deposition - Solar cell production
Problems Solved: - Inefficient plasma generation in PVD processes - Low deposition rates - Poor film quality due to inadequate plasma density
Benefits: - Increased deposition rates - Enhanced film quality - Improved process efficiency
Commercial Applications: Title: "Advanced Plasma Generation System for PVD Processes" This technology can be utilized in semiconductor fabrication facilities, solar panel manufacturing plants, and other industries requiring precise thin film deposition processes.
Prior Art: Researchers can explore prior patents related to plasma generation systems for PVD processes, resonant structures in plasma technology, and advancements in thin film deposition techniques.
Frequently Updated Research: Researchers are constantly exploring new materials and methods to enhance plasma generation and thin film deposition in PVD processes.
Questions about Plasma Generation Systems for PVD Processes: 1. How does the resonant structure improve plasma generation efficiency? 2. What are the key factors influencing the quality of the deposited film in PVD processes?
Original Abstract Submitted
Systems and methods provide a solution for efficiently generating high density plasma for a physical vapor deposition (PVD). The present solution includes a vacuum chamber for a PVD process. The system can include a target located within the vacuum chamber for sputtering a material onto a wafer. The system can include a resonant structure formed by an antenna and a plurality of capacitors. The resonant structure can be configured to provide a pulsed output at a resonant frequency. The resonant structure can be configured to generate, via the antenna and based on the pulsed output, a plasma between the target and a location of the wafer to ionize the material sputtered from the target.
