17968638. Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes simplified abstract (Microfabrica Inc.)
Contents
- 1 Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to traditional probe designs in terms of performance and cost?
- 1.11 What are the potential limitations or challenges in implementing this technology on a large scale?
- 1.12 Original Abstract Submitted
Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
Organization Name
Inventor(s)
Arun S. Veeramani of Vista CA (US)
Ming Ting Wu of San Jose CA (US)
Dennis R. Smalley of Newhall CA (US)
Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes - A simplified explanation of the abstract
This abstract first appeared for US patent application 17968638 titled 'Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
Simplified Explanation
The patent application describes probes for contacting electronic components, which include compliant modules stacked in a serial configuration supported by a sheath, exoskeleton, or endoskeleton allowing for linear longitudinal compression of probe ends towards one another. The compliant elements within the modules include planar springs, which may be spirals, interlaced spirals, or transition into multiple thinner planar spring elements along their length.
- Compliant modules stacked in a serial configuration
- Supported by a sheath, exoskeleton, or endoskeleton
- Linear longitudinal compression of probe ends
- Compliant elements include planar springs
- Planar springs may be spirals, interlaced spirals, or transition into multiple thinner planar spring elements
Potential Applications
The technology could be applied in the fields of electronics testing, semiconductor manufacturing, and quality control processes.
Problems Solved
The technology solves the problem of accurately and reliably contacting electronic components for testing and manufacturing purposes.
Benefits
The benefits of this technology include improved accuracy, reliability, and efficiency in electronic component testing and manufacturing processes.
Potential Commercial Applications
- "Innovative Probes for Electronic Component Testing and Manufacturing: Advancements in Contact Technology"
Possible Prior Art
There may be prior art related to probes for contacting electronic components using compliant elements such as planar springs, but further research is needed to identify specific examples.
Unanswered Questions
How does this technology compare to traditional probe designs in terms of performance and cost?
The article does not provide a direct comparison between this technology and traditional probe designs in terms of performance and cost.
What are the potential limitations or challenges in implementing this technology on a large scale?
The article does not address potential limitations or challenges in implementing this technology on a large scale.
Original Abstract Submitted
Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner planar spring elements along their length. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
