17968601. Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes simplified abstract (Microfabrica Inc.)
Contents
- 1 Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
Organization Name
Inventor(s)
Arun S. Veeramani of Vista CA (US)
Ming Ting Wu of San Jose CA (US)
Dennis R. Smalley of Newhall CA (US)
Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes - A simplified explanation of the abstract
This abstract first appeared for US patent application 17968601 titled 'Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
Simplified Explanation
The patent application describes probes for contacting electronic components that include compliant modules stacked in a serial configuration, supported by a sheath, exoskeleton, or endoskeleton allowing for linear longitudinal compression of probe ends. The compliant elements within the modules include planar springs, which may be spirals or interlaced spirals with similar or different rotational orientations.
- Compliant modules stacked in a serial configuration
- Supported by a sheath, exoskeleton, or endoskeleton
- Linear longitudinal compression of probe ends
- Compliant elements include planar springs like spirals or interlaced spirals
- Planar springs may transition into multiple thinner elements along their length
Potential Applications
The technology could be used in semiconductor testing, electronic device manufacturing, and quality control processes.
Problems Solved
The innovation solves the challenge of accurately and reliably contacting electronic components during testing and manufacturing processes.
Benefits
The benefits of this technology include improved accuracy, reliability, and efficiency in electronic component testing and manufacturing.
Potential Commercial Applications
Potential commercial applications include semiconductor testing equipment, electronic device manufacturing machinery, and quality control systems.
Possible Prior Art
One possible prior art could be the use of compliant modules in probe technology for electronic component testing and manufacturing processes.
Unanswered Questions
1. How does the design of the planar springs contribute to the overall performance of the probes? 2. Are there any specific industries or applications where this technology would not be suitable or effective?
Original Abstract Submitted
Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner planar spring elements along their length. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
