17956798. SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
Contents
- 1 SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to existing communication device packaging methods?
- 1.11 What are the specific materials used in the construction of the multi-layer package substrate?
- 1.12 Original Abstract Submitted
SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Juan Herbsommer of Allen TX (US)
Rajen Manicon Murugan of Dallas TX (US)
SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17956798 titled 'SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS
Simplified Explanation
The semiconductor package described in the abstract includes a semiconductor die, a conductive member, and a multi-layer package substrate with horizontal metal layers, vertical members, and a mold compound.
- The semiconductor package includes a semiconductor die, a conductive member, and a multi-layer package substrate.
- The multi-layer package substrate consists of a first horizontal metal layer for ground connection, a second horizontal metal layer above the first layer, vertical members connecting the horizontal metal layers, and a mold compound covering them.
- The structure formed by the first horizontal metal layer, the second horizontal metal layer, and the vertical members includes a conductive strip, a transition member, a waveguide, and a horn antenna.
Potential Applications
This technology could be applied in:
- Wireless communication devices
- Radar systems
- Satellite communication systems
Problems Solved
This technology helps in:
- Improving signal transmission efficiency
- Enhancing the performance of communication devices
Benefits
The benefits of this technology include:
- Increased signal strength
- Better signal reception
- Enhanced communication range
Potential Commercial Applications
This technology could be commercially applied in:
- Telecommunications industry
- Aerospace industry
- Consumer electronics industry
Possible Prior Art
One possible prior art could be the use of similar multi-layer package substrates in semiconductor packages for communication devices.
Unanswered Questions
How does this technology compare to existing communication device packaging methods?
This article does not provide a direct comparison with existing communication device packaging methods.
What are the specific materials used in the construction of the multi-layer package substrate?
The article does not specify the exact materials used in the construction of the multi-layer package substrate.
Original Abstract Submitted
In some examples, a semiconductor package includes a semiconductor die; a conductive member coupled to the semiconductor die; and a multi-layer package substrate. The multi-layer package substrate includes a first horizontal metal layer to provide a ground connection; a second horizontal metal layer above the first horizontal metal layer; vertical members coupling to the first and second horizontal metal layers; and a mold compound covering the first and second horizontal metal layers and the vertical members. The first horizontal metal layer, the second horizontal metal layer, and the vertical members together form a structure including a conductive strip coupled to the conductive member, a transition member coupled to the conductive strip, a waveguide coupled to the transition member, and a horn antenna coupled to the waveguide.
