17956794. DOUBLE STITCH WIREBONDS simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
Contents
- 1 DOUBLE STITCH WIREBONDS
DOUBLE STITCH WIREBONDS
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
DOUBLE STITCH WIREBONDS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17956794 titled 'DOUBLE STITCH WIREBONDS
Simplified Explanation
The semiconductor package described in the patent application includes an electrically conductive surface and a bond wire connected to the surface. The bond wire consists of a first stitch bond and a second stitch bond that partially overlaps with the first stitch bond.
- The semiconductor package comprises an electrically conductive surface.
- A bond wire is coupled to the electrically conductive surface.
- The bond wire includes a first stitch bond connected to the surface.
- A second stitch bond is contiguous with the first stitch bond and also connected to the surface.
- The second stitch bond partially overlaps with the first stitch bond.
Potential Applications
The technology described in this patent application could be applied in the manufacturing of various semiconductor devices, such as integrated circuits, sensors, and microprocessors.
Problems Solved
This innovation helps improve the reliability and performance of semiconductor packages by providing a more secure and stable connection between the bond wire and the electrically conductive surface.
Benefits
The benefits of this technology include enhanced electrical conductivity, increased durability, and improved overall functionality of semiconductor packages.
Potential Commercial Applications
With its potential to enhance the performance and reliability of semiconductor devices, this technology could find applications in industries such as electronics, telecommunications, automotive, and aerospace.
Possible Prior Art
One possible prior art in this field could be the use of different bonding techniques in semiconductor packaging, such as ball bonding or wedge bonding, to establish connections between bond wires and conductive surfaces.
Unanswered Questions
How does this technology compare to existing bonding methods in terms of cost-effectiveness and efficiency?
This article does not provide a direct comparison between this technology and other bonding methods commonly used in semiconductor packaging. Further research and analysis would be needed to determine the cost-effectiveness and efficiency of this innovation compared to existing methods.
What are the potential challenges or limitations of implementing this technology on a large scale in semiconductor manufacturing processes?
The article does not address the potential challenges or limitations that may arise when implementing this technology on a large scale in semiconductor manufacturing. Factors such as scalability, compatibility with existing processes, and production costs would need to be considered in further studies.
Original Abstract Submitted
In some examples, a semiconductor package comprises an electrically conductive surface and a bond wire coupled to the electrically conductive surface. The bond wire includes a first stitch bond coupled to the electrically conductive surface, and a second stitch bond contiguous with the first stitch bond and coupled to the electrically conductive surface. The second stitch bond is partially, but not completely, overlapping with the first stitch bond.
