17956296. TECHNOLOGIES FOR PEROVSKITE TRANSISTORS simplified abstract (Intel Corporation)

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TECHNOLOGIES FOR PEROVSKITE TRANSISTORS

Organization Name

Intel Corporation

Inventor(s)

Ian Alexander Young of Olympia WA (US)

Dmitri Evgenievich Nikonov of Beaverton OR (US)

Marko Radosavljevic of Portland OR (US)

Matthew V. Metz of Portland OR (US)

John J. Plombon of Portland OR (US)

Raseong Kim of Portland OR (US)

Kevin P. O'brien of Portland OR (US)

Scott B. Clendenning of Portland OR (US)

Tristan A. Tronic of Aloha OR (US)

Dominique A. Adams of Portland OR (US)

Carly Rogan of North Plains OR (US)

Hai Li of Portland OR (US)

Arnab Sen Gupta of Hillsboro OR (US)

Gauri Auluck of Hillsboro OR (US)

I-Cheng Tung of Hillsboro OR (US)

Brandon Holybee of Portland OR (US)

Rachel A. Steinhardt of Beaverton OR (US)

Punyashloka Debashis of Hillsboro OR (US)

TECHNOLOGIES FOR PEROVSKITE TRANSISTORS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17956296 titled 'TECHNOLOGIES FOR PEROVSKITE TRANSISTORS

Simplified Explanation

The patent application describes technologies for a field effect transistor (FET) with a ferroelectric gate dielectric. Here are some key points from the abstract:

  • Perovskite stack grown on a buffer layer for manufacturing the transistor
  • Perovskite stack includes doped semiconductor layers alternating with other lattice-matched layers
  • Doped semiconductor layers can be improved in quality by growing them on lattice-matched layers
  • Lattice-matched layers can be etched away, leaving doped semiconductor layers as fins for a ribbon FET
  • Interlayer deposited on top of a semiconductor layer, with a ferroelectric layer on the interlayer to bridge a gap in lattice parameters

Potential Applications

The technology could be applied in the development of high-performance transistors for various electronic devices, such as smartphones, computers, and sensors.

Problems Solved

The technology addresses the need for improved performance and efficiency in semiconductor devices by utilizing a ferroelectric gate dielectric in FETs.

Benefits

The benefits of this technology include enhanced transistor performance, increased efficiency, and potentially lower power consumption in electronic devices.

Potential Commercial Applications

The technology could have commercial applications in the semiconductor industry, particularly in the production of advanced electronic devices with improved performance and energy efficiency.

Possible Prior Art

One possible prior art could be the use of ferroelectric materials in memory devices, but the specific application of a ferroelectric gate dielectric in FETs as described in the patent application may be a novel innovation.

Unanswered Questions

How does the performance of FETs with a ferroelectric gate dielectric compare to traditional FETs in terms of speed and power consumption?

The article does not provide a direct comparison between FETs with a ferroelectric gate dielectric and traditional FETs in terms of speed and power consumption.

Are there any challenges or limitations in implementing this technology on a large scale for commercial production?

The article does not address any potential challenges or limitations in scaling up the production of FETs with a ferroelectric gate dielectric for commercial applications.


Original Abstract Submitted

Technologies for a field effect transistor (FET) with a ferroelectric gate dielectric are disclosed. In an illustrative embodiment, a perovskite stack is grown on a buffer layer as part of manufacturing a transistor. The perovskite stack includes one or more doped semiconductor layers alternating with other lattice-matched layers, such as undoped semiconductor layers. Growing the doped semiconductor layers on lattice-matched layers can improve the quality of the doped semiconductor layers. The lattice-matched layers can be preferentially etched away, leaving the doped semiconductor layers as fins for a ribbon FET. In another embodiment, an interlayer can be deposited on top of a semiconductor layer, and a ferroelectric layer can be deposited on the interlayer. The interlayer can bridge a gap in lattice parameters between the semiconductor layer and the ferroelectric layer.