17956013. NON-HOMOGENEOUS CHIPLETS simplified abstract (ADVANCED MICRO DEVICES, INC.)
Contents
- 1 NON-HOMOGENEOUS CHIPLETS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 NON-HOMOGENEOUS CHIPLETS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
NON-HOMOGENEOUS CHIPLETS
Organization Name
Inventor(s)
Matthaeus G. Chajdas of Munich (DE)
NON-HOMOGENEOUS CHIPLETS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17956013 titled 'NON-HOMOGENEOUS CHIPLETS
Simplified Explanation
The semiconductor module described in the patent application comprises multiple non-homogeneous semiconductor dies with different supporting circuitry modules. An interconnect connects the semiconductor dies, allowing for routing commands based on the capabilities of each die's circuitry modules.
- Each semiconductor die has a unique set of supporting circuitry modules.
- The semiconductor dies share a set of common circuitry modules.
- An interconnect links the semiconductor dies together.
- Commands can be directed to specific semiconductor dies based on their individual circuitry module capabilities.
Potential Applications
This technology could be applied in:
- High-performance computing systems
- Advanced communication devices
- Automotive electronics
Problems Solved
- Efficient routing of commands to specific semiconductor dies
- Optimization of processing capabilities based on individual die specifications
Benefits
- Enhanced performance and efficiency
- Customization of processing tasks
- Increased flexibility in semiconductor module design
Potential Commercial Applications
Optimizing Command Routing in Non-Homogeneous Semiconductor Modules
Possible Prior Art
There may be prior art related to optimizing command routing in semiconductor modules, but specific examples are not provided in this patent application.
Unanswered Questions
How does this technology impact power consumption in semiconductor modules?
The patent application does not address the potential impact of this technology on power consumption in semiconductor modules.
Are there any limitations to the number of semiconductor dies that can be connected in this manner?
The patent application does not mention any limitations on the number of semiconductor dies that can be connected using this technology.
Original Abstract Submitted
A semiconductor module comprises multiple non-homogeneous semiconductor dies disposed on the semiconductor module, with each semiconductor die having a set of circuitry modules that are common to all of the semiconductor dies and also a set of supporting circuitry modules that are distinct between the semiconductor dies. An interconnect communicatively couples the semiconductor dies together. Commands for processing by the semiconductor module may be routed to individual semiconductor dies based on capabilities of the particular circuitry modules disposed on those individual semiconductor dies.
