17949801. HEAT DISSIPATION APPARATUS AND SERVER simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
Contents
HEAT DISSIPATION APPARATUS AND SERVER
Organization Name
Inventor(s)
HEAT DISSIPATION APPARATUS AND SERVER - A simplified explanation of the abstract
This abstract first appeared for US patent application 17949801 titled 'HEAT DISSIPATION APPARATUS AND SERVER
Simplified Explanation
The abstract describes a heat dissipation apparatus that includes a substrate, a heat dissipation component, and heat dissipation fins. The fins are designed to dissipate heat on the substrate, while the heat dissipation component is fastened on the other side of the substrate. The component has a gap between its side surface and the substrate, and its second surface is used to attach to a component that needs heat dissipation. The area on the other side of the substrate is used to attach to another component with lower heating power.
- The apparatus includes a heat dissipation substrate, heat dissipation component, and heat dissipation fins.
- The heat dissipation fins are placed on one side of the substrate to dissipate heat.
- The heat dissipation component is fastened on the other side of the substrate.
- There is a gap between the side surface of the component and the substrate.
- The second surface of the component is used to attach to a component that needs heat dissipation.
- The area on the other side of the substrate is used to attach to a component with lower heating power.
Potential Applications
- Electronics cooling systems
- Computer processors and graphics cards
- LED lighting systems
- Power electronics
Problems Solved
- Efficient heat dissipation in electronic devices
- Preventing overheating and damage to components
- Improving performance and reliability of devices
Benefits
- Enhanced heat dissipation capabilities
- Improved thermal management in electronic systems
- Increased lifespan and reliability of components
- Reduced risk of overheating and system failures
Original Abstract Submitted
A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.
