17948943. PLASMA BAFFLE, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

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PLASMA BAFFLE, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

SUMIN Park of Yongin-si (KR)

SUNGHWAN Kim of Hanam-si (KR)

HAKYOUNG Kim of Bucheon-si (KR)

DAEHYUN Lee of Suwon-si (KR)

DONGYUN Yeo of Seoul (KR)

MINYOUNG Hur of Hwaseong-si (KR)

PLASMA BAFFLE, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17948943 titled 'PLASMA BAFFLE, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME

Simplified Explanation

The patent application describes a plasma battle structure consisting of a lower ring and an upper ring. The lower ring has a central hole and a slit, while the upper ring has a central hole and a slit connecting its inner and outer surfaces.

  • The plasma battle structure consists of a lower ring and an upper ring.
  • The lower ring has a central hole and a slit, while the upper ring also has a central hole and a slit.
  • The central holes vertically penetrate their respective rings.
  • The lower slit is located outside the lower central hole and vertically penetrates the lower ring.
  • The upper slit connects the inner and outer lateral surfaces of the upper ring.

Potential applications of this technology:

  • Plasma battles in entertainment or gaming industries.
  • Plasma-based research and experimentation.
  • Plasma-based energy generation or propulsion systems.

Problems solved by this technology:

  • Provides a structured and controlled environment for plasma battles.
  • Allows for precise manipulation and control of plasma.
  • Enhances the safety and efficiency of plasma-based systems.

Benefits of this technology:

  • Improved performance and accuracy in plasma battles.
  • Increased safety and control in plasma-based applications.
  • Potential for advancements in plasma-based technologies.


Original Abstract Submitted

A plasma battle includes a lower ring and an upper ring that extends upwardly from an edge of the lower ring. The lower ring includes a lower central hole on a center of the lower ring and vertically penetrating the lower ring and a lower slit outside the lower central hole and vertically penetrating the lower ring. The upper ring includes an upper central hole on a center of the upper ring and vertically penetrating the upper ring and an upper slit that penetrates the upper ring so as to connect an inner lateral surface of the upper ring to an outer lateral surface of the upper ring.