17943915. COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS simplified abstract (Intel Corporation)
Contents
- 1 COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Unanswered Questions
- 1.10 Original Abstract Submitted
COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS
Organization Name
Inventor(s)
Brandon C. Marin of Gilbert AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Kristof Darmawikarta of Chandler AZ (US)
Jeremy D. Ecton of Gilbert AZ (US)
Suddhasattwa Nad of Chandler AZ (US)
Hiroki Tanaka of Gilbert AZ (US)
Pooya Tadayon of Portland OR (US)
COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17943915 titled 'COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS
Simplified Explanation
The abstract describes interposers made of glass with cavities and vias for electronic applications.
- Glass substrate interposers with cavities and vias:
* Interposers are made of glass substrates. * They have a cavity on one surface and a via below it. * A pad is located in the cavity over the via. * Another pad is on the opposite surface under the via.
Potential Applications
Glass substrate interposers can be used in:
- High-speed electronic devices
- Microelectronics
- Semiconductor packaging
Problems Solved
Glass substrate interposers address issues such as:
- Thermal management
- Electrical performance
- Miniaturization of electronic devices
Benefits
The benefits of glass substrate interposers include:
- Improved signal integrity
- Enhanced thermal dissipation
- Higher reliability in electronic systems
Potential Commercial Applications
Glass substrate interposers can be applied in:
- 5G communication systems
- Automotive electronics
- Internet of Things (IoT) devices
Unanswered Questions
How does the glass material affect the performance of the interposers compared to other materials?
Glass substrates offer unique properties that may impact the electrical and thermal characteristics of the interposers, but further research is needed to fully understand these effects.
What are the limitations of using glass substrate interposers in harsh environments?
The durability and reliability of glass substrate interposers in extreme conditions, such as high temperatures or mechanical stress, require investigation to determine their suitability for such applications.
Original Abstract Submitted
Embodiments disclosed herein include interposers and methods of forming interposers. In an embodiment, an interposer comprises a substrate with a first surface and a second surface opposite from the first surface, where the substrate comprises glass. In an embodiment, the interposer further comprises a cavity into the first surface of the substrate, a via through the substrate below the cavity, a first pad in the cavity over the via, and a second pad on the second surface of the substrate under the via.
- Intel Corporation
- Brandon C. Marin of Gilbert AZ (US)
- Gang Duan of Chandler AZ (US)
- Srinivas V. Pietambaram of Chandler AZ (US)
- Kristof Darmawikarta of Chandler AZ (US)
- Jeremy D. Ecton of Gilbert AZ (US)
- Suddhasattwa Nad of Chandler AZ (US)
- Hiroki Tanaka of Gilbert AZ (US)
- Pooya Tadayon of Portland OR (US)
- H01L23/15
- H01L23/00
- H01L23/538