17943580. EMBEDDED METAL PADS simplified abstract (Micron Technology, Inc.)
Contents
- 1 EMBEDDED METAL PADS
EMBEDDED METAL PADS
Organization Name
Inventor(s)
Tsung Han Chiang of Taichung City (TW)
Shin Yueh Yang of Taichung City (TW)
EMBEDDED METAL PADS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17943580 titled 'EMBEDDED METAL PADS
Simplified Explanation
The patent application describes methods, apparatuses, and systems related to embedded metal pads in semiconductor devices. The example device includes a metal pad embedded in a dielectric material, with a mask material on a portion of the dielectric surface, an upper portion of the metal pad, and a contact pillar on a second portion of the metal pad's top surface.
- Metal pads embedded in dielectric material in semiconductor devices
- Mask material on dielectric surface and metal pad
- Contact pillar on metal pad's top surface
- Contact pillar comprises metal pillar and pillar bump
Potential Applications
The technology described in the patent application could be applied in the manufacturing of semiconductor devices, specifically in improving the design and functionality of metal pads within these devices.
Problems Solved
This technology solves the problem of ensuring proper contact and connectivity within semiconductor devices by embedding metal pads in dielectric material and providing contact pillars for improved performance.
Benefits
The benefits of this technology include enhanced reliability, improved electrical connections, and potentially increased efficiency in semiconductor devices.
Potential Commercial Applications
The technology could have commercial applications in the semiconductor industry, particularly in the production of advanced electronic devices that require precise and reliable metal pad designs.
Possible Prior Art
One possible prior art in this field could be the use of metal pads in semiconductor devices, but the specific design and structure described in this patent application may be novel and innovative.
Unanswered Questions
How does this technology compare to existing metal pad designs in semiconductor devices?
This article does not provide a direct comparison to existing metal pad designs in semiconductor devices. Further research or analysis would be needed to determine the specific advantages or differences between this technology and current practices.
What potential challenges or limitations could arise in implementing this technology on a larger scale in semiconductor manufacturing?
The article does not address potential challenges or limitations in scaling up the implementation of this technology in semiconductor manufacturing processes. Additional studies or testing may be required to assess the feasibility and practicality of widespread adoption.
Original Abstract Submitted
Methods, apparatuses, and systems related to embedded metal pads are described. An example semiconductor device includes a dielectric material, a metal pad having side surface, where a lower portion of the side surface is embedded in the dielectric material, a mask material on a portion of a surface of the dielectric material, an upper portion of the side surface of the metal pad, and a portion of a top surface of the metal pad and a contact pillar on a second portion of the top surface of metal pad, the contact pillar comprising a metal pillar and a pillar bump.
