17935119. SEMICONDUCTOR DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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SEMICONDUCTOR DEVICES

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

HYERAN Lee of Hwaseong-Si (KR)

Sohyun Park of Seoul (KR)

Junhyeok Ahn of Suwon-Si (KR)

SEMICONDUCTOR DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 17935119 titled 'SEMICONDUCTOR DEVICES

Simplified Explanation

The patent application describes a semiconductor device that includes a conductive contact plug, a bit line structure, spacers, and a capping pattern. The conductive contact plug has a lower portion with a wider width and an upper portion with a narrower width. The bit line structure is stacked on the conductive contact plug and consists of a conductive structure and an insulation structure. The spacers are stacked on the sidewall of the lower portion of the conductive contact plug, and the capping pattern covers the sidewall of the upper portion of the conductive contact plug. The first spacer directly contacts the sidewall of the lower portion of the conductive contact plug and contains air.

  • The semiconductor device includes a conductive contact plug with a wider lower portion and a narrower upper portion.
  • The bit line structure is stacked on the conductive contact plug and consists of a conductive structure and an insulation structure.
  • Spacers are stacked on the sidewall of the lower portion of the conductive contact plug.
  • The capping pattern covers the sidewall of the upper portion of the conductive contact plug.
  • The first spacer directly contacts the sidewall of the lower portion of the conductive contact plug and contains air.

Potential Applications

  • This technology can be applied in the manufacturing of semiconductor devices, such as integrated circuits and microprocessors.

Problems Solved

  • The design of the conductive contact plug with a narrower upper portion allows for more efficient use of space in the semiconductor device.
  • The use of spacers and a capping pattern helps to protect and stabilize the conductive contact plug.

Benefits

  • The semiconductor device with this design can have improved performance and functionality.
  • The use of spacers and a capping pattern enhances the durability and reliability of the conductive contact plug.


Original Abstract Submitted

A semiconductor device includes a conductive contact plug disposed on a substrate, a bit line structure disposed on the conductive contact plug, first and second spacers, and a capping pattern disposed on the first and second spacers. The conductive contact plug includes a lower portion that has a first width and an upper portion that has a second width narrower than the first width. The bit line structure includes a conductive structure and an insulation structure stacked in a vertical direction. The first and second spacers are stacked on a sidewall of the lower portion of the conductive contact plug in a horizontal direction. The capping pattern covers a sidewall of the upper portion of the conductive contact plug. The first spacer directly contacts the sidewall of the lower portion of the conductive contact plug and includes air.