17934121. ELECTROPLATING SHIELD DEVICE simplified abstract (HONEYWELL INTERNATIONAL INC.)
Contents
- 1 ELECTROPLATING SHIELD DEVICE
ELECTROPLATING SHIELD DEVICE
Organization Name
Inventor(s)
Christian Wiggins of Phoenix AZ (US)
James Piascik of Morris Plains NJ (US)
Joseph W. Mintzer, Iii of Phoenix AZ (US)
ELECTROPLATING SHIELD DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17934121 titled 'ELECTROPLATING SHIELD DEVICE
Simplified Explanation
The abstract describes an electroplating shield device and methods of fabricating and using it for electroplating. The device includes a conduit with openings for transferring fluid to form a layer on an object, with a specific ratio of thickness between different sections of the object after forming the layer.
- The electroplating shield device includes a conduit with openings positioned between inner and outer surfaces, allowing fluid to transfer to different sections of the object.
- The method of electroplating involves positioning an object in the shield device and forming a layer on the object by transferring fluid through the openings to achieve a specific thickness ratio between sections of the object.
Potential Applications
The technology can be used in industries such as electronics, automotive, and jewelry for precise and controlled electroplating processes.
Problems Solved
The device helps in achieving uniform and controlled plating thickness on different sections of an object, improving the overall quality of the electroplated product.
Benefits
- Enhanced precision in electroplating processes - Improved efficiency and consistency in plating thickness - Reduction in material waste and rework due to precise control
Potential Commercial Applications
"Precision Electroplating Shield Device for Enhanced Plating Control"
Possible Prior Art
Prior art may include traditional electroplating methods that lack the precision and control offered by the electroplating shield device.
Unanswered Questions
How does the device handle different shapes and sizes of objects during electroplating?
The device's design allows for flexibility in accommodating various shapes and sizes of objects, ensuring uniform plating results.
What materials are compatible with the electroplating shield device?
The device is typically made from materials such as stainless steel or plastic that are compatible with common electroplating solutions and processes.
Original Abstract Submitted
An electroplating shield device, methods of fabricating the same, and methods of electroplating with the electroplating shield device are disclosed herein. The method of electroplating includes positioning an object in an electroplating shield device. The electroplating shield device may include a conduit configured to receive the object and a plurality of openings selectively extended between inner and outer surfaces of the conduit. The openings may be positioned between first and second ends of the conduit. The method may also include forming a layer on the object by transferring fluid through the plurality of openings to at least one of a first continuous section of the object comprising a minor of the object and a second continuous section of the object comprising a major of the object. A ratio of a thickness of the major to the minor after forming the layer may range from approximately 1:1 to approximately 1:18.
