17933968. ALIGNMENT-OVERLAY MARK AND METHOD USING THE SAME simplified abstract (Micron Technology, Inc.)
Contents
- 1 ALIGNMENT-OVERLAY MARK AND METHOD USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ALIGNMENT-OVERLAY MARK AND METHOD USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
ALIGNMENT-OVERLAY MARK AND METHOD USING THE SAME
Organization Name
Inventor(s)
KAZUKO Yamashita of Hiroshima (JP)
TOSHIHARU Nishiyama of Hiroshima (JP)
ALIGNMENT-OVERLAY MARK AND METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17933968 titled 'ALIGNMENT-OVERLAY MARK AND METHOD USING THE SAME
Simplified Explanation
The alignment-overlay mark in this patent application includes a pair of first marks and a plurality of second marks arranged in a specific pattern to aid in alignment processes.
- The first marks extend in a first direction and are arranged in parallel to each other in a second direction.
- The second marks are positioned between the first marks, extend in the second direction, and are arranged in parallel to each other in the first direction.
Potential Applications
The technology described in this patent application could be used in various industries such as printing, manufacturing, and electronics for precise alignment of components or materials.
Problems Solved
This technology solves the problem of accurately aligning objects or materials during manufacturing processes, reducing errors and improving overall product quality.
Benefits
The benefits of this technology include increased efficiency in production processes, higher accuracy in alignment tasks, and improved consistency in final products.
Potential Commercial Applications
One potential commercial application of this technology could be in the semiconductor industry for aligning layers during the fabrication of microchips, leading to higher yields and better performance.
Possible Prior Art
One possible prior art for this technology could be existing alignment marks used in various industries for similar purposes, but the specific arrangement and design of the alignment-overlay mark in this patent application may be unique.
Unanswered Questions
How does the alignment-overlay mark compare to other alignment methods in terms of accuracy and efficiency?
The article does not provide a direct comparison between the alignment-overlay mark and other alignment methods, leaving the reader to wonder about the relative advantages and disadvantages of each approach.
Are there any limitations or constraints in the implementation of the alignment-overlay mark in different manufacturing processes?
The article does not address any potential limitations or constraints that may arise when implementing the alignment-overlay mark in diverse manufacturing environments, leaving room for further exploration and analysis.
Original Abstract Submitted
According to one or more embodiments of the disclosure, an alignment-overlay mark is provided. The alignment-overlay mark includes a pair of first marks and a plurality of second marks. The first marks extend in a first direction and are arranged in parallel to each other in a second direction. The second direction is perpendicular to the first direction. The second marks are between the first marks, extend in the second direction and are arranged in parallel to each other in the first direction.
