17927792. WIRING BOARD, FUNCTIONAL BACKPLANE, BACKLIGHT MODULE, DISPLAY PANEL AND DISPLAY APPARATUS simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)

WIRING BOARD, FUNCTIONAL BACKPLANE, BACKLIGHT MODULE, DISPLAY PANEL AND DISPLAY APPARATUS

Organization Name

BOE TECHNOLOGY GROUP CO., LTD.

Inventor(s)

Jiayu He of Beijing (CN)

Yan Qu of Beijing (CN)

Ce Ning of Beijing (CN)

Zhengliang Li of Beijing (CN)

Hehe Hu of Beijing (CN)

Jie Huang of Beijing (CN)

Nianqi Yao of Beijing (CN)

Kun Zhao of Beijing (CN)

Feifei Li of Beijing (CN)

Qi Qi of Beijing (CN)

WIRING BOARD, FUNCTIONAL BACKPLANE, BACKLIGHT MODULE, DISPLAY PANEL AND DISPLAY APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17927792 titled 'WIRING BOARD, FUNCTIONAL BACKPLANE, BACKLIGHT MODULE, DISPLAY PANEL AND DISPLAY APPARATUS

The abstract of the patent application describes a wiring board that includes a substrate, conductive pads, and at least one protective layer group. The conductive pads are located on the substrate, while the protective layer group is positioned on the side of the conductive pads away from the substrate. The protective layer group consists of an oxidation protective layer and a palladium alloy layer stacked on top of each other, with the oxidation protective layer closer to the substrate than the palladium alloy layer. The oxidation protective layer is made of a nickel-based alloy.

• The wiring board includes a substrate, conductive pads, and a protective layer group.
• The conductive pads are on the substrate, and the protective layer group is on the side of the pads away from the substrate.
• The protective layer group comprises an oxidation protective layer and a palladium alloy layer stacked together.
• The oxidation protective layer, made of a nickel-based alloy, is closer to the substrate than the palladium alloy layer.
• This design aims to provide protection against oxidation and enhance the durability of the wiring board.

Potential Applications: - Electronics manufacturing - Circuit board assembly - Aerospace industry for reliable connections

Problems Solved: - Protection against oxidation - Enhanced durability of wiring boards - Improved reliability of electronic connections

Benefits: - Increased longevity of wiring boards - Enhanced performance in harsh environments - Improved conductivity and signal transmission

Commercial Applications: Title: Advanced Wiring Boards for Enhanced Durability and Reliability This technology can be utilized in various industries such as electronics manufacturing, aerospace, and telecommunications for improved performance and longevity of electronic connections.

Questions about Wiring Boards: 1. How does the oxidation protective layer contribute to the durability of the wiring board? The oxidation protective layer helps prevent oxidation of the conductive pads, ensuring long-term reliability and performance of the wiring board.

2. What are the potential commercial applications of this innovative wiring board technology? This technology can be applied in electronics manufacturing, aerospace, and telecommunications industries to enhance the durability and reliability of electronic connections.

Original Abstract Submitted

A wiring board includes a substrate, conductive pads and at least one protective layer group. The conductive pads are disposed on the substrate. The at least one protective layer group is disposed on a side of the conductive pads away from the substrate; a protective layer group includes an oxidation protective layer and a palladium alloy layer that are stacked, and the oxidation protective layer is closer to the substrate than the palladium alloy layer. A material of the oxidation protective layer includes a nickel-based alloy.