17926946. CAMERA MODULE STRUCTURE AND ELECTRONIC DEVICE simplified abstract (HONOR DEVICE CO., LTD.)
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CAMERA MODULE STRUCTURE AND ELECTRONIC DEVICE
Organization Name
Inventor(s)
CAMERA MODULE STRUCTURE AND ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17926946 titled 'CAMERA MODULE STRUCTURE AND ELECTRONIC DEVICE
The camera module structure described in the patent application includes a mainboard, a first camera module, a second camera module, and a TOF device. The TOF device is positioned between the first and second camera modules, which are mounted on hollowed-out brackets.
- The TOF device is located between the first and second camera modules.
- The mainboard has a spacing portion that separates the mounting portions of the camera modules.
- The TOF device is placed on an auxiliary circuit board that is wider than the spacing portion.
- The auxiliary circuit board is connected to the mainboard and partially overlaps with the spacing portion.
- The auxiliary circuit board has a material removal portion on its lower surface.
Potential Applications: - This camera module structure could be used in smartphones, tablets, or other electronic devices. - It may find applications in augmented reality (AR) and virtual reality (VR) devices. - The technology could be utilized in security systems or surveillance cameras.
Problems Solved: - The structure provides a compact and efficient way to integrate multiple camera modules and a TOF device. - It ensures proper alignment and spacing between the components for optimal performance.
Benefits: - Improved functionality and performance of devices with multiple cameras and TOF capabilities. - Enhanced accuracy and precision in depth sensing and imaging applications. - Space-saving design for compact electronic devices.
Commercial Applications: Title: "Advanced Camera Module Structure for Electronic Devices" This technology could be valuable for smartphone manufacturers, AR/VR device makers, and companies developing security systems. The compact design and improved functionality could attract consumers looking for high-quality imaging and depth sensing capabilities in their devices.
Questions about the technology: 1. How does the positioning of the TOF device between the camera modules improve performance? 2. What are the specific advantages of using an auxiliary circuit board in this camera module structure?
Original Abstract Submitted
A camera module structure is provided which includes a mainboard, a first camera module, a second camera module, and a TOF device. The TOF device is located between the first camera module and the second camera module, which are respectively mounted to a first mounting portion and a second mounting portion that are hollowed-out via the brackets. The mainboard includes a spacing portion for separation between the first mounting portion and the second mounting portion. The TOF device is disposed on an upper surface of an auxiliary circuit board; the auxiliary circuit board is greater than the spacing portion in width; the auxiliary circuit board is located on an upper surface of the mainboard, and the auxiliary circuit board is connected to the mainboard and at least partially overlapped with the spacing portion; and the auxiliary circuit board is provided with a material removal portion on a lower surface.
