17920811. Light Emitting Substrate, Preparation Method Therefor, and Display Device simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
Contents
Light Emitting Substrate, Preparation Method Therefor, and Display Device
Organization Name
BOE TECHNOLOGY GROUP CO., LTD.
Inventor(s)
Light Emitting Substrate, Preparation Method Therefor, and Display Device - A simplified explanation of the abstract
This abstract first appeared for US patent application 17920811 titled 'Light Emitting Substrate, Preparation Method Therefor, and Display Device
Simplified Explanation: The patent application describes a light emitting substrate with specific structures and components for improved performance in display devices.
Key Features and Innovation:
- Light emitting substrate with a base substrate, die bonding structure, light shielding structure, and light emitting chip.
- Light emitting chip positioned away from the base substrate for optimal performance.
- Light shielding structure with shielding material layer and partition structure.
- Flux functional layer covering the die bonding structure.
- Partition structure blocking the flux functional layer.
Potential Applications: The technology can be used in various display devices such as TVs, monitors, and smartphones to enhance the quality of light emission.
Problems Solved: The technology addresses issues related to light emission efficiency, heat dissipation, and overall display performance in electronic devices.
Benefits:
- Improved light emission efficiency.
- Enhanced heat dissipation capabilities.
- Better overall display performance.
Commercial Applications: The technology can be applied in the manufacturing of display devices for consumer electronics, potentially leading to higher quality and more efficient products in the market.
Prior Art: Readers interested in prior art related to this technology can explore patents and research papers in the field of display technology, light emitting substrates, and semiconductor devices.
Frequently Updated Research: Stay updated on advancements in display technology, semiconductor materials, and light emitting substrates to understand the latest developments in the field.
Questions about Light Emitting Substrates: 1. What are the key components of a light emitting substrate?
- A light emitting substrate typically consists of a base substrate, die bonding structure, light shielding structure, and a light emitting chip.
2. How does the positioning of the light emitting chip impact performance?
- Placing the light emitting chip away from the base substrate can optimize performance by improving light emission efficiency and heat dissipation.
Original Abstract Submitted
A light emitting substrate, a preparation method therefor, and a display device are provided. The light emitting substrate includes a base substrate, a die bonding structure, a light shielding structure and a light emitting chip disposed on the base substrate, wherein the light emitting chip is disposed at a side of the die bonding structure away from the base substrate, the light shielding structure is located at a peripheral side of the light emitting chip, the light emitting substrate further comprises a flux functional layer covering the side of the die bonding structure away from the base substrate, the light shielding structure comprises a shielding material layer and a partition structure, and the flux functional layer is blocked at the partition structure.
