17918214. LIGHT EMITTING CHIP AND PRODUCING METHOD THEREOF, AND LIGHT EMITTING APPARATUS simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
Contents
LIGHT EMITTING CHIP AND PRODUCING METHOD THEREOF, AND LIGHT EMITTING APPARATUS
Organization Name
BOE TECHNOLOGY GROUP CO., LTD.
Inventor(s)
LIGHT EMITTING CHIP AND PRODUCING METHOD THEREOF, AND LIGHT EMITTING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17918214 titled 'LIGHT EMITTING CHIP AND PRODUCING METHOD THEREOF, AND LIGHT EMITTING APPARATUS
The present disclosure introduces a light emitting chip and its production method, along with a light emitting apparatus. The chip consists of a patterned substrate, a light emitting unit with an electron injection layer, a luminescent layer, and a hole injection layer, as well as first and second electrodes, a first passivation layer, and a heat dissipating layer.
- Patterned substrate
- Light emitting unit with electron injection layer, luminescent layer, and hole injection layer
- First and second electrodes
- First passivation layer partially covering the light emitting unit, electrodes, with an opening exposing part of the unit
- Heat dissipating layer covering the passivation layer and part of the light emitting unit
Potential Applications: - LED lighting - Display technology - Automotive lighting
Problems Solved: - Improved heat dissipation - Enhanced light emitting efficiency
Benefits: - Increased longevity of the light emitting chip - Higher performance in various applications
Commercial Applications: Title: Advanced LED Lighting Solutions This technology can be utilized in various industries such as lighting, displays, and automotive sectors, providing efficient and long-lasting lighting solutions.
Prior Art: Readers can explore prior patents related to light emitting chips, LED technology, and heat dissipation methods to understand the evolution of this innovation.
Frequently Updated Research: Stay updated on the latest advancements in LED technology, heat dissipation techniques, and display innovations to enhance the application of this light emitting chip.
Questions about Light Emitting Chips: 1. How does the heat dissipating layer contribute to the efficiency of the light emitting chip? 2. What are the potential challenges in integrating this technology into existing lighting systems?
Original Abstract Submitted
The present disclosure provides a light emitting chip and a producing method thereof, and a light emitting apparatus. The light emitting chip includes a patterned substrate; a light emitting unit, wherein the light emitting unit includes an electron injection layer, a luminescent layer and a hole injection layer; a first electrode, wherein the first electrode is connected to the electron injection layer; a second electrode, wherein the second electrode is connected to the hole injection layer; a first passivation layer, wherein the first passivation layer partially covers the light emitting unit, the first electrode and the second electrode, the first passivation layer includes a first opening, and the light emitting unit partially exposes from the first opening; and a heat dissipating layer, wherein the heat dissipating layer covers the first passivation layer, and a part of the light emitting unit exposing from the first passivation layer.
