17915733. DATA PROCESSING METHODS AND SYSTEMS, AND COMPUTER-READABLE STORAGE MEDIA simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
Contents
DATA PROCESSING METHODS AND SYSTEMS, AND COMPUTER-READABLE STORAGE MEDIA
Organization Name
BOE TECHNOLOGY GROUP CO., LTD.
Inventor(s)
DATA PROCESSING METHODS AND SYSTEMS, AND COMPUTER-READABLE STORAGE MEDIA - A simplified explanation of the abstract
This abstract first appeared for US patent application 17915733 titled 'DATA PROCESSING METHODS AND SYSTEMS, AND COMPUTER-READABLE STORAGE MEDIA
The abstract describes a data processing method and system for analyzing defect points in substrates to be inspected, improving efficiency and production yield.
- Acquiring target data from multiple analysis units and inspection data from substrates with defect points.
- Superimposing defect points to obtain a data set for clustering calculations.
- Performing clustering calculations to identify repeated defect points.
- Generating alarm information for device contact positions corresponding to the identified defect clusters.
- Shortening the time interval between production and analysis of repeated defects for improved efficiency.
- Timely inspection of repeated defects to enhance production yield.
Potential Applications: This technology can be applied in industries such as semiconductor manufacturing, quality control, and automated inspection systems.
Problems Solved: The method addresses the challenge of timely detection and analysis of repeated defects in substrates, leading to improved production efficiency and yield.
Benefits: Improved data processing efficiency, timely detection of repeated defects, enhanced production yield, and quality control.
Commercial Applications: This technology can be utilized in semiconductor manufacturing plants, electronics production facilities, and quality control departments to streamline defect analysis processes and enhance overall production efficiency.
Prior Art: Researchers can explore prior art related to defect analysis in semiconductor manufacturing, automated inspection systems, and quality control processes to understand the evolution of similar technologies.
Frequently Updated Research: Stay updated on advancements in defect analysis algorithms, clustering techniques, and quality control methodologies to enhance the efficiency and accuracy of defect detection processes.
Questions about the Technology: 1. How does this technology compare to traditional defect analysis methods?
- The technology offers a more efficient and timely approach to detecting and analyzing repeated defects in substrates, improving production yield.
2. What are the potential challenges in implementing this technology in different industries?
- Implementing the technology may require integration with existing production processes and quality control systems, as well as training for personnel on data processing methods and defect analysis techniques.
Original Abstract Submitted
A data processing method and system, and a computer-readable storage medium. The method includes: acquiring target data, the target data including data from a plurality of analysis units (); acquiring, from each of the analysis units, inspection data of a plurality of substrates to be inspected that contain defect points (); superimposing the defect points in the plurality of substrates to be inspected to obtain a data set of the defect points (); performing a clustering calculation on the data set of the defect points to obtain a first cluster set of the defect points (); and generating, based on the first cluster set of the defect points, alarm information for a device contact position corresponding to the first cluster set (). With the method, the substrates to be inspected in each analysis unit are analyzed, and a time interval between the process of production and the process of analysis of repeated defects is shortened, which is conducive to improving the data processing efficiency. Moreover, with the method, it is possible to detect the defect points that are repeatedly defective at the same position, i.e., to obtain the first cluster set of the defect points, so as to achieve the effect of timely inspection of the repeated defects caused by the production device, which is conducive to improving a production yield of the substrates to be inspected.
