17908036. ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE
Organization Name
BOE TECHNOLOGY GROUP CO., LTD.
Inventor(s)
ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17908036 titled 'ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE
The present disclosure describes a method for manufacturing an array substrate, involving the formation of multiple layers and patterning to create electrodes and protective layers.
- Formation of a first electrode material layer, a conductive enhancement material layer, and a protective material layer with varying oxidation resistance levels.
- Application of a mask pattern on the protective material layer to expose specific areas for further processing.
- Ashing process to remove parts of the mask pattern and reveal the underlying layers.
- Patterning of the electrode material layer to create electrodes.
- Patterning of the protective material layer and conductive enhancement material layer to form protective and conductive enhancement layers.
Potential Applications: - Display technologies - Touchscreen devices - Solar panels
Problems Solved: - Improved oxidation resistance - Enhanced conductivity - Precise patterning of layers
Benefits: - Increased durability - Improved performance - Enhanced functionality
Commercial Applications: Title: Advanced Array Substrate Manufacturing Method This technology can be utilized in the production of high-quality displays, touchscreens, and solar panels, leading to more reliable and efficient electronic devices.
Questions about Array Substrate Manufacturing Method: 1. How does the oxidation resistance of the protective material layer compare to that of the conductive enhancement material layer?
The protective material layer has stronger oxidation resistance compared to the conductive enhancement material layer, ensuring better long-term performance.
2. What is the purpose of the ashing process in the manufacturing method?
The ashing process is used to remove specific portions of the mask pattern to expose the underlying layers for further processing.
Original Abstract Submitted
The present disclosure relates to a manufacturing method for an array substrate, including: forming a first electrode material layer, a conductive enhancement material layer and a protective material layer in sequence, oxidation resistance of the protective material layer being stronger than that of the conductive enhancement material layer; forming a mask pattern on a side of the protective material layer away from the first electrode material layer, the mask pattern including a first portion and a second portion, and a thickness of the first portion being greater than that of the second portion; performing ashing on the mask pattern to remove the second portion to expose the protective material layer covered by the second portion; patterning the first electrode material layer to form a first electrode; and patterning the protective material layer and the conductive enhancement material layer to form a protective layer and a conductive enhancement layer.
