17904748. ARRAY SUBSTRATE, DISPLAY APPARATUS, AND CONNECTION PAD simplified abstract (BOE Technology Group Co., Ltd.)
Contents
ARRAY SUBSTRATE, DISPLAY APPARATUS, AND CONNECTION PAD
Organization Name
BOE Technology Group Co., Ltd.
Inventor(s)
ARRAY SUBSTRATE, DISPLAY APPARATUS, AND CONNECTION PAD - A simplified explanation of the abstract
This abstract first appeared for US patent application 17904748 titled 'ARRAY SUBSTRATE, DISPLAY APPARATUS, AND CONNECTION PAD
Simplified Explanation: The patent application describes an array substrate with a connection pad area that includes multiple first and second probe contact pads, along with corresponding first and second connection lines in different layers.
- The connection pad area of the array substrate contains multiple first probe contact pads and second probe contact pads.
- Each first probe contact pad is connected to a first connection line, while each second probe contact pad is connected to a second connection line.
- The first connection lines and second connection lines are in separate layers within the array substrate.
- The total number of conductive layers connected to each first connection line differs from the total number of conductive layers connected to each second connection line.
Key Features and Innovation:
- Multiple layers of connection lines for improved connectivity.
- Distinct layers for first and second connection lines to prevent interference.
- Varied number of conductive layers for each connection line for optimized performance.
Potential Applications: The technology can be applied in various electronic devices requiring precise and efficient connections, such as display panels, touchscreens, and sensors.
Problems Solved: The technology addresses issues related to signal interference, connection reliability, and overall performance in array substrates with connection pads.
Benefits:
- Enhanced connectivity and signal transmission.
- Improved reliability and performance of electronic devices.
- Reduced signal interference and crosstalk.
Commercial Applications: The technology can be utilized in the manufacturing of smartphones, tablets, smartwatches, and other electronic devices with display panels or touchscreens to enhance their performance and reliability in data transmission.
Prior Art: Readers can explore prior patents related to array substrates, connection pads, and conductive layers in electronic devices to understand the evolution of this technology.
Frequently Updated Research: Researchers are continuously exploring new materials and manufacturing techniques to further improve the performance and efficiency of array substrates with connection pads.
Questions about Array Substrate with Connection Pad: 1. How does the technology of multiple layers of connection lines improve the performance of electronic devices? 2. What are the potential challenges in implementing different numbers of conductive layers for each connection line in array substrates?
Original Abstract Submitted
An array substrate having a connection pad in a connection pad area is provided. The connection pad includes a plurality of first probe contact pads, a plurality of second probe contact pads, a plurality of first connection lines coupled to the plurality of first probe contact pads, respectively, and a plurality of second connection lines coupled to the plurality of second probe contact pads, respectively; the plurality of first connection lines and the plurality of second connection lines being in two different layers. A total number of conductive layers electrically connected to a respective first connection line of the plurality of first connection lines is different from a total number of conductive layers electrically connected to a respective second connection line of the plurality of second connection lines.
