17899477. SUBSTRATES WITH CONTINUOUS SLOT VIAS simplified abstract (Micron Technology, Inc.)

SUBSTRATES WITH CONTINUOUS SLOT VIAS

Organization Name

Micron Technology, Inc.

Inventor(s)

Walter L. Moden of Boise ID (US)

Stephen F. Moxham of Boise ID (US)

Travis M. Jensen of Boise ID (US)

SUBSTRATES WITH CONTINUOUS SLOT VIAS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17899477 titled 'SUBSTRATES WITH CONTINUOUS SLOT VIAS

Simplified Explanation

• • Explanation:**

The patent application describes substrates with continuous slot vias that shield data signals from crosstalk between signaling vias.

• • Bullet Points:**
• Substrates have continuous slot vias between signaling vias to prevent crosstalk.
• Slot vias extend laterally within the intermediary layer between design layers.
• Slot vias shield data signals on signaling vias from interference with each other.

• • Potential Applications:**
• High-speed data transmission in electronic devices.
• Circuit boards for telecommunications equipment.
• Signal routing in computer systems.

• • Problems Solved:**
• Crosstalk interference between data signals on signaling vias.
• Maintaining signal integrity in densely packed circuitry.
• Ensuring reliable data transmission in electronic devices.

• • Benefits:**
• Improved signal quality and reduced interference.
• Enhanced performance of electronic devices.
• Increased reliability of data transmission.

Original Abstract Submitted

Substrates with continuous slot vias are disclosed herein. In one embodiment, a substrate comprises a first design layer, a second design layer, and an intermediary layer between the first and second design layers. The substrate further includes first and second signaling vias extending vertically through the intermediary layer between the first and second design layers. The first and second signaling vias route first and second data signals, respectively, between the first and second design layers. The substrate further includes a slot via that is positioned between the first and second signaling vias within the intermediary layer and extends laterally within the intermediary layer along a path that passes between the first signaling via and the second signaling via. The slot via can have a continuous shape such that the slot via shields the first and second data signals on the first and second signaling vias from crosstalk with one another.