17897775. IMAGE SENSOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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IMAGE SENSOR

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Changyong Um of Seoul (KR)

IMAGE SENSOR - A simplified explanation of the abstract

This abstract first appeared for US patent application 17897775 titled 'IMAGE SENSOR

Simplified Explanation

The abstract describes an image sensor that includes multiple substrates and layers to improve its performance and functionality. Here are the key points:

  • The image sensor has a first substrate with a floating diffusion region near its surface.
  • A second substrate is placed on top of the first substrate.
  • An intermediate substrate is positioned between the first and second substrates.
  • A first transistor is located on the bottom surface of the intermediate substrate.
  • A contact pattern connects the first transistor to the floating diffusion region.
  • An upper interconnection layer is present on the bottom surface of the intermediate substrate.
  • A lower interconnection layer is situated between the upper interconnection layer and the second substrate.
  • Conductive pads establish electrical connections between the upper and lower interconnection layers.
  • A capacitor is placed on the second substrate.
  • The contact pattern penetrates the intermediate substrate and makes contact with the floating diffusion region.
  • The capacitor is positioned closer to the second substrate compared to the conductive pads.

Potential applications of this technology:

  • Image sensors for digital cameras, smartphones, and other electronic devices.
  • Surveillance cameras and security systems.
  • Medical imaging devices.
  • Automotive cameras for driver assistance systems.

Problems solved by this technology:

  • Improved image quality and sensitivity due to the optimized design of the image sensor.
  • Enhanced signal processing and noise reduction capabilities.
  • Increased integration and miniaturization of image sensor components.

Benefits of this technology:

  • Higher resolution and better image quality in various lighting conditions.
  • Reduced noise and improved low-light performance.
  • Compact and efficient design for smaller electronic devices.
  • Enhanced functionality and performance of image sensors in different applications.


Original Abstract Submitted

An image sensor may include a first substrate having first and second surfaces opposite to each other and including a floating diffusion region provided near the first surface, a second substrate provided on the first surface of the first substrate, an intermediate substrate disposed between the first and second substrates, a first transistor disposed on a bottom surface of the intermediate substrate, a contact pattern electrically connecting the first transistor to the floating diffusion region, an upper interconnection layer provided on a bottom surface of the intermediate substrate, a lower interconnection layer between the upper interconnection layer and the second substrate, conductive pads electrically connecting the upper and lower interconnection layers, and a capacitor disposed on the second substrate. The contact pattern may penetrate the intermediate substrate and may be in contact with the floating diffusion region. The capacitor may be closer to the second substrate than the conductive pads.