17896097. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

From WikiPatents
Jump to navigation Jump to search

PACKAGE STRUCTURE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Chih-Wei Wu of Yilan County (TW)

Ying-Ching Shih of Hsinchu City (TW)

Wen-Chih Chiou of Miaoli County (TW)

PACKAGE STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17896097 titled 'PACKAGE STRUCTURE

Simplified Explanation

The patent application describes a package structure for an electronic device, including a semiconductor die, redistribution circuit structure, backside dielectric layer, conductive terminals, an electronic device, and an underfill.

  • The semiconductor die is encapsulated by an insulating encapsulation.
  • The redistribution circuit structure is placed on the semiconductor die and the insulating encapsulation, consisting of redistribution conductive layers and thermal enhancement structures.
  • The thermal enhancement structures are thermally coupled to the semiconductor die.
  • The backside dielectric layer is on top of the redistribution circuit structure.
  • The conductive terminals go through the backside dielectric layer.
  • The electronic device is positioned over the backside dielectric layer and connected to the redistribution circuit structure through the conductive terminals.
  • The underfill is between the backside dielectric layer and the electronic device, being thermally coupled to the thermal enhancement structures.

---

      1. Potential Applications
  • Advanced packaging for electronic devices
  • High-performance computing systems
  • Aerospace and defense electronics
      1. Problems Solved
  • Improved thermal management for electronic devices
  • Enhanced electrical connectivity and reliability
  • Miniaturization of electronic components
      1. Benefits
  • Better heat dissipation
  • Increased performance and reliability
  • Compact design for space-constrained applications


Original Abstract Submitted

A package structure including a semiconductor die, a redistribution circuit structure, a backside dielectric layer, conductive terminals, an electronic device, and an underfill is provided. The semiconductor die laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes redistribution conductive layers and thermal enhancement structures electrically insulated from the redistribution conductive layers, and the thermal enhancement structures are thermally coupled to the semiconductor die. The backside dielectric layer is disposed on the redistribution circuit structure. The conductive terminals penetrate through the backside dielectric layer. The electronic device is disposed over the backside dielectric layer and electrically connected to the redistribution circuit structure through the conductive terminals. The underfill is disposed between the backside dielectric layer and the electronic device, wherein the underfill is thermally coupled to the thermal enhancement structures.

Retrieved from "http://wikipatents.org/index.php?title=17896097._PACKAGE_STRUCTURE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=36821"