17891629. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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SEMICONDUCTOR DEVICE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Hyungjun Jeon of Seoul (KR)

Kwangjin Moon of Hwaseong-si (KR)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17891629 titled 'SEMICONDUCTOR DEVICE

Simplified Explanation

Abstract

A semiconductor package is described that includes multiple semiconductor chips and various layers to connect and protect them. The package includes a first semiconductor chip with pads and an insulating layer, a second semiconductor chip with upper pads, lower pads, and through electrodes, and a third semiconductor chip with upper pads, lower pads, and dummy electrode structures. The package also includes an encapsulant to seal and cover the chips, and bump structures below them.

Bullet Points

  • The semiconductor package includes multiple semiconductor chips and layers to connect and protect them.
  • The first semiconductor chip has pads and an insulating layer.
  • The second semiconductor chip has upper pads, lower pads, and through electrodes.
  • The third semiconductor chip has upper pads, lower pads, and dummy electrode structures.
  • The package includes an encapsulant to seal and cover the chips.
  • Bump structures are present below the chips.

Potential Applications

  • This semiconductor package can be used in various electronic devices and systems that require multiple semiconductor chips to be connected and protected.
  • It can be applied in industries such as telecommunications, computing, automotive, and consumer electronics.

Problems Solved

  • The semiconductor package solves the problem of connecting and protecting multiple semiconductor chips in a compact and efficient manner.
  • It addresses the challenge of ensuring proper electrical connections between the chips and preventing damage or contamination.

Benefits

  • The package provides a reliable and robust solution for integrating multiple semiconductor chips.
  • It offers improved electrical performance and signal integrity.
  • The encapsulant and bump structures enhance the durability and reliability of the package.


Original Abstract Submitted

A semiconductor package includes a first semiconductor chip including first pads and a first insulating layer, and a second semiconductor chip including second upper pads, a second insulating layer, second lower pads, and through electrodes connecting the second upper pads and the second lower pads to each other. The package includes a third semiconductor chip including third upper pads, an upper barrier layer, a third insulating layer, third lower pads, a lower barrier layer, and dummy electrode structures connecting the third upper pads and the third lower pads to each other. The package includes an encapsulant below the first semiconductor chip to seal at least a portion of each of the second and third semiconductor chips and cover side surfaces of the third lower pads. The package includes bump structures below the encapsulant and the second and third semiconductor chips.

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