17868308. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17868308 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The abstract describes a semiconductor package design that includes a semiconductor chip, a dam structure, and an adhesive layer. The dam structure surrounds the semiconductor chip and consists of two portions - a longer first dam portion and a shorter second dam portion connected to it. The adhesive layer is placed on the package substrate and has two portions as well. The first adhesive portion is located between the semiconductor chip and the package substrate, overlapping the chip vertically. The second adhesive portion is on the outer side of the chip and includes a section that contacts the top surface of the first dam portion.
- The semiconductor package includes a semiconductor chip, a dam structure, and an adhesive layer.
- The dam structure surrounds the semiconductor chip and consists of a longer first dam portion and a shorter second dam portion.
- The adhesive layer is placed on the package substrate and has two portions - one between the chip and substrate, and another on the outer side of the chip.
- The second adhesive portion contacts the top surface of the first dam portion.
Potential applications of this technology:
- Semiconductor packaging industry
- Electronics manufacturing
Problems solved by this technology:
- Provides improved protection and support for the semiconductor chip
- Helps prevent damage and contamination during packaging and handling
Benefits of this technology:
- Enhanced reliability and durability of semiconductor packages
- Improved performance and longevity of electronic devices
Original Abstract Submitted
A semiconductor package includes a semiconductor chip on a package substrate, a dam structure disposed on the package substrate and surrounding the semiconductor chip, the dam structure including a first dam portion having a first length in a vertical direction, and a second dam portion connected to the first dam portion and extending from an outer side of the first dam portion, and having a second length less than the first length in the vertical direction, and an adhesive layer disposed on the package substrate, the adhesive layer including a first adhesive portion disposed between the semiconductor chip and the package substrate and overlapping the semiconductor chip in the vertical direction, and a second adhesive portion on an outer side of the semiconductor chip and including at least a part contacting a top surface of the first dam portion.
