17851170. SEMICONDUCTOR CHIP AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR CHIP AND METHOD OF FABRICATING THE SAME
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SEMICONDUCTOR CHIP AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17851170 titled 'SEMICONDUCTOR CHIP AND METHOD OF FABRICATING THE SAME
Simplified Explanation
The patent application describes a method for designing and fabricating a semiconductor chip with a fuse cell. The method involves several steps, including preparing a layout for the chip, placing a fuse layout in a designated area, and separating the main chip layout and the fuse layout for data preparation. The resulting structures are merged to generate mask data, which is then used to manufacture a photomask. Finally, semiconductor chips are formed on a wafer using the photomask.
- Method for designing and fabricating a semiconductor chip with a fuse cell
- Includes preparing a layout for the chip and placing a fuse layout in a designated area
- Separates the main chip layout and the fuse layout for data preparation
- Generates mask data by merging resulting structures from the data preparation process
- Manufactures a photomask based on the mask data
- Forms semiconductor chips on a wafer using the photomask
Potential Applications
- Semiconductor chip manufacturing
- Integrated circuit design
- Electronics industry
Problems Solved
- Efficiently designing and fabricating semiconductor chips with fuse cells
- Streamlining the data preparation process for chip layout and fuse layout
- Improving the manufacturing process for semiconductor chips
Benefits
- Simplifies the design and fabrication of semiconductor chips with fuse cells
- Increases efficiency and accuracy in the data preparation process
- Enhances the overall manufacturing process for semiconductor chips
Original Abstract Submitted
Disclosed is a method of designing and fabricating a semiconductor chip including a fuse cell. The method may include preparing a semiconductor chip layout, the semiconductor chip layout including a main chip layout and a scribe lane layout enclosing the main chip layout; disposing a fuse layout in the scribe lane layout; setting the main chip layout as a first data preparation region; setting the scribe lane layout and the fuse layout as a second data preparation region; obtaining a first resulting structure and a second resulting structure, respectively, by performing a data preparation process on the first and second data preparation regions; merging the first and second resulting structures to generate mask data; manufacturing a photomask, based on the mask data; and forming semiconductor chips on a wafer using the photomask.
