17843967. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
KYOUNG LIM Suk of Suwon-si (KR)
SEOKHYUN Lee of Hwaseong-si (KR)
HYEONJEONG Hwang of Cheonan-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17843967 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The patent application describes a semiconductor package that includes multiple layers and patterns to improve heat dissipation and performance. Here are the key points:
- The semiconductor package consists of a first redistribution substrate with an insulating layer and redistribution pattern.
- A lower semiconductor chip is mounted on the first redistribution substrate.
- A conductive structure is placed on the first redistribution substrate, spaced horizontally from the lower semiconductor chip.
- A first mold layer covers the lower semiconductor chip and conductive structure, sandwiched between the first and second redistribution substrates.
- The second redistribution substrate is located on top of the first redistribution substrate, consisting of a second insulating layer and redistribution pattern.
- A first heat-dissipation pattern is positioned between the lower semiconductor chip and the second insulating layer.
- A heat-dissipation pad is present on the conductive structure.
- The top surface of the first heat-dissipation pattern is higher than the top surface of the conductive structure.
Potential applications of this technology:
- Semiconductor packaging for electronic devices such as smartphones, tablets, and computers.
- High-performance computing systems.
- Automotive electronics.
- Internet of Things (IoT) devices.
Problems solved by this technology:
- Improved heat dissipation, preventing overheating and enhancing overall performance.
- Efficient redistribution of electrical signals within the semiconductor package.
- Enhanced reliability and durability of the semiconductor package.
Benefits of this technology:
- Better thermal management, leading to improved performance and longevity of electronic devices.
- Increased signal integrity and reduced signal loss within the semiconductor package.
- Compact design, allowing for smaller and thinner electronic devices.
- Cost-effective manufacturing process.
Original Abstract Submitted
A semiconductor package is disclosed. The semiconductor package may include a first redistribution substrate including a first insulating layer and a first redistribution pattern, a lower semiconductor chip mounted on the first redistribution substrate, a conductive structure disposed on the first redistribution substrate and horizontally spaced apart from the lower semiconductor chip, a first mold layer interposed between the first redistribution substrate and the second redistribution substrate to cover the lower semiconductor chip and the conductive structure, a second redistribution substrate on the first redistribution substrate, the second redistribution substrate including a second insulating layer and a second redistribution pattern, a first heat-dissipation pattern interposed between the lower semiconductor chip and the second insulating layer, and a heat-dissipation pad on the conductive structure. A top surface of the first heat-dissipation pattern may be located at a level higher than a top surface of the conductive structure.
