17833438. CHUCK ASSEMBLY, FABRICATION SYSTEM THEREWITH, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 CHUCK ASSEMBLY, FABRICATION SYSTEM THEREWITH, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CHUCK ASSEMBLY, FABRICATION SYSTEM THEREWITH, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Original Abstract Submitted
CHUCK ASSEMBLY, FABRICATION SYSTEM THEREWITH, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
Organization Name
Inventor(s)
Seongha Jeong of Hwaseong-si (KR)
Kyung-Sun Kim of Suwon-si (KR)
Donghyeon Na of Hwaseong-si (KR)
Ungyo Jung of Hwaseong-si (KR)
CHUCK ASSEMBLY, FABRICATION SYSTEM THEREWITH, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17833438 titled 'CHUCK ASSEMBLY, FABRICATION SYSTEM THEREWITH, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
Simplified Explanation
The abstract describes a chuck assembly for a semiconductor processing tool. The chuck assembly includes a chuck base with a lower base and an upper base, a ceramic plate on the upper base, an isolator ring enclosing the outer sidewall of the lower base, a focus ring on the edge portion of the lower base and the isolator ring, and a pad between the edge portion of the lower base and the focus ring. The pad may contain a nonmetal conductive material.
- The chuck assembly is designed for use in a semiconductor processing tool.
- It includes a lower base and an upper base, with a ceramic plate on the upper base.
- An isolator ring encloses the outer sidewall of the lower base.
- A focus ring is placed on the edge portion of the lower base and the isolator ring.
- A pad is positioned between the edge portion of the lower base and the focus ring.
- The pad may contain a nonmetal conductive material.
Potential Applications
- Semiconductor processing tools
- Wafer handling and processing equipment
Problems Solved
- Provides a stable and reliable chuck assembly for semiconductor processing tools.
- Helps to prevent damage to delicate semiconductor wafers during processing.
- Reduces the risk of electrostatic discharge.
Benefits
- Improved performance and accuracy in semiconductor processing.
- Enhanced protection for delicate wafers.
- Increased reliability and longevity of the chuck assembly.
Original Abstract Submitted
A chuck assembly includes a chuck base including a lower base and an upper base that is on the lower base, a ceramic plate on the upper base, an isolator ring enclosing an outer sidewall of the lower base, a focus ring on an edge portion of the lower base and the isolator ring, the focus ring enclosing an outer sidewall of the upper base, and a pad that is between the edge portion of the lower base and the focus ring. The pad may contain a nonmetal conductive material.
