17827063. REDISTRIBUTION SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
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REDISTRIBUTION SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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REDISTRIBUTION SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17827063 titled 'REDISTRIBUTION SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Simplified Explanation
The patent application describes redistribution substrates and semiconductor packages that include these substrates. The semiconductor package consists of a redistribution substrate, a semiconductor chip mounted on the substrate, and an inductor structure within the substrate that is electrically connected to the chip.
- The inductor structure includes an outer coil pattern with vertical and horizontal parts, and an inner coil pattern between the vertical parts that is connected to the outer coil pattern.
- The horizontal part of the inductor structure is made up of a first conductive layer and a second conductive layer, with the second layer being thinner than the first layer.
Potential applications of this technology:
- This technology can be used in various electronic devices that require inductors, such as smartphones, tablets, and computers.
- It can also be applied in power management systems, wireless communication devices, and automotive electronics.
Problems solved by this technology:
- The use of redistribution substrates allows for a more compact and efficient design of semiconductor packages.
- The inductor structure within the substrate provides a space-saving solution for integrating inductors into the package.
Benefits of this technology:
- The compact design of the semiconductor package allows for more efficient use of space within electronic devices.
- The integration of inductors within the substrate reduces the need for additional components, leading to cost savings and improved reliability.
- The thinner second conductive layer in the inductor structure helps to reduce the overall thickness of the package, making it more suitable for thin and lightweight devices.
Original Abstract Submitted
Disclosed are redistribution substrates and semiconductor packages including the same. The semiconductor package comprises a redistribution substrate, a semiconductor chip mounted on the redistribution substrate, and an inductor structure in the redistribution substrate and electrically connected to the semiconductor chip. The inductor structure includes an outer coil pattern including a plurality of vertical parts and a horizontal part that connects the plurality of vertical parts to each other, and an inner coil pattern between the vertical parts and electrically connected to the outer coil pattern. The horizontal part includes a first conductive layer, and a second conductive layer between the first conductive layer and the inner coil pattern. The second conductive layer has a thickness that is less than a thickness of the first conductive layer.
