17821920. Warpage Compensation for BGA Package simplified abstract (Apple Inc.)
Contents
Warpage Compensation for BGA Package
Organization Name
Inventor(s)
Brett W. Degner of Menlo Park CA (US)
Jie-Hua Zhao of Cupertino CA (US)
Kristopher P. Laurent of Portola Valley CA (US)
Michael E. Leclerc of Mountain View CA (US)
Rangaraj Dhanasekaran of San Jose CA (US)
Simon J. Trivett of Waterloo (CA)
Warpage Compensation for BGA Package - A simplified explanation of the abstract
This abstract first appeared for US patent application 17821920 titled 'Warpage Compensation for BGA Package
Simplified Explanation
The abstract describes an electronic assembly and method of assembly that involves bonding a stiffener structure to a module substrate opposite a ball grid array (BGA) package. The stiffener structure is bonded at an elevated temperature after the BGA package is bonded to maintain a flat or near-flat surface contour of the module substrate.
- The electronic assembly includes a stiffener structure bonded to the module substrate opposite the BGA package.
- The stiffener structure is shear bonded at an elevated temperature.
- The bonding of the stiffener structure is performed after the BGA package is bonded to the module substrate.
- The purpose of the stiffener structure is to maintain a flat or near-flat surface contour of the module substrate.
Potential Applications
- Electronic manufacturing industry
- Circuit board assembly
Problems Solved
- Ensures a flat or near-flat surface contour of the module substrate
- Provides stability and support to the electronic assembly
Benefits
- Improved reliability and durability of electronic assemblies
- Reduces the risk of damage or failure due to uneven surfaces or warping
Original Abstract Submitted
Electronic assemblies and methods of assembly are described. In an embodiment, an electronic assembly includes a stiffener structure shear bonded to an opposite side of a module substrate from a ball grid array (BGA) package. The stiffener structure may be shear bonded at elevated temperature after bonding of the BGA package to lock in a flat or near-flat surface contour of the module substrate.
