17819269. BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS simplified abstract (QUALCOMM Incorporated)
BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS
Organization Name
Inventor(s)
Dongming He of San Diego CA (US)
Hung-Yuan Hsu of Taichung (TW)
Yangyang Sun of San Diego CA (US)
Lily Zhao of San Diego CA (US)
BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17819269 titled 'BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS
Simplified Explanation
- Techniques for selectively boosting conductive pillar bumps are disclosed in the patent application. - The apparatus includes metal pads, boosting pads, and conductive pillar bumps of varying heights. - The first set of conductive pillar bumps is shorter than the second set, but within a tolerance threshold when combined with the heights of the boosting pads. - Solder is attached to both sets of conductive pillar bumps.
Potential Applications
This technology could be applied in the manufacturing of electronic devices, such as integrated circuits or semiconductor components, where precise control over the height of conductive pillar bumps is required.
Problems Solved
- Ensures uniformity in the heights of conductive pillar bumps, which is crucial for reliable electrical connections in electronic devices. - Provides a method for selectively boosting certain conductive pillar bumps without affecting others, allowing for customization in the manufacturing process.
Benefits
- Improved reliability and performance of electronic devices due to consistent heights of conductive pillar bumps. - Flexibility in design and customization of electronic components by selectively boosting certain bumps. - Enhanced efficiency in manufacturing processes by ensuring precise control over bump heights.
Original Abstract Submitted
Disclosed are techniques for selectively boosting conductive pillar bumps. In an aspect, an apparatus includes a plurality of metal pads, a first set of boosting pads attached to a first set of the plurality of metal pads, a first set of conductive pillar bumps attached to the first set of boosting pads, a second set of conductive pillar bumps attached to a second set of the plurality of metal pads, wherein heights of the first set of conductive pillar bumps are shorter than heights of the second set of conductive pillar bumps, and wherein heights of the first set of boosting pads plus the heights of the first set of conductive pillar bumps are within a tolerance threshold of the heights of the second set of conductive pillar bumps, and solder attached to the first set of conductive pillar bumps and the second set of conductive pillar bumps.
