17816759. CAMERA MODULE FOR HEAT DISSIPATION AND GROUND AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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CAMERA MODULE FOR HEAT DISSIPATION AND GROUND AND ELECTRONIC DEVICE INCLUDING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Minki Cho of Suwon-si (KR)

Jungsoo Kim of Suwon-si (KR)

Dohyun Ahn of Suwon-si (KR)

Wonchul Cho of Suwon-si (KR)

Taeyun Kim of Suwon-si (KR)

Wonjun Jeong of Suwon-si (KR)

Kwangsic Choi of Suwon-si (KR)

Chonguk Heo of Suwon-si (KR)

CAMERA MODULE FOR HEAT DISSIPATION AND GROUND AND ELECTRONIC DEVICE INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17816759 titled 'CAMERA MODULE FOR HEAT DISSIPATION AND GROUND AND ELECTRONIC DEVICE INCLUDING THE SAME

Simplified Explanation

The patent application describes a camera module that includes various components to improve its performance and heat dissipation capabilities. Here are the key points:

  • The camera module consists of a printed circuit board (PCB) with a conductive pad exposed on one surface.
  • An image sensor is placed on the PCB, which captures the visual data.
  • A conductive plate is positioned between the PCB and the image sensor, connected to the conductive pad on the PCB.
  • An actuator is located above the image sensor and is responsible for adjusting the position of the lens assembly.
  • To protect and shield the actuator, a shield can is placed around it, which is also electrically connected to the conductive plate.
  • The conductive plate serves the purpose of dissipating the heat generated by the image sensor to the external environment through contact with the image sensor.

Potential applications of this technology:

  • Mobile phones and smartphones
  • Digital cameras
  • Surveillance systems
  • Automotive cameras
  • Drones and other unmanned aerial vehicles (UAVs)

Problems solved by this technology:

  • Heat dissipation: The conductive plate helps in efficiently dissipating the heat generated by the image sensor, preventing overheating and potential damage to the camera module.
  • Component protection: The shield can safeguards the actuator from external elements, ensuring its proper functioning and longevity.

Benefits of this technology:

  • Enhanced performance: Efficient heat dissipation allows the camera module to operate at optimal temperatures, resulting in improved image quality and overall performance.
  • Increased durability: The shield can protects the actuator from dust, moisture, and other potential hazards, increasing the lifespan of the camera module.
  • Compact design: The integration of the conductive plate and shield can into the camera module ensures a compact and space-saving design, making it suitable for various applications.


Original Abstract Submitted

A camera module includes: a printed circuit board having a conductive pad exposed on one surface of the printed circuit board, an image sensor disposed on the printed circuit board, a conductive plate disposed between the printed circuit board and the image sensor and electrically connected to the conductive pad, an actuator disposed above the image sensor and configured to adjust a position of a lens assembly, and a shield can surrounding the actuator and electrically connected to the conductive plate. The conductive plate is configured to emit heat generated from the image sensor to the outside of the camera module by contact with the image sensor.