17802447. PLATING METHOD AND PLATING APPARATUS simplified abstract (EBARA CORPORATION)
Contents
PLATING METHOD AND PLATING APPARATUS
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PLATING METHOD AND PLATING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17802447 titled 'PLATING METHOD AND PLATING APPARATUS
Simplified Explanation: The technique described in the patent application allows for the removal of gas bubbles that are attached to a hole in an ionically resistive element.
Key Features and Innovation:
- Technique for removing gas bubbles from ionically resistive elements
- Addresses the issue of gas bubbles affecting the performance of such elements
- Improves the efficiency and functionality of ionically resistive elements
Potential Applications: This technology could be applied in various industries such as:
- Electronics
- Energy storage
- Medical devices
Problems Solved: The technology addresses the following issues:
- Gas bubbles affecting the performance of ionically resistive elements
- Potential decrease in efficiency due to gas bubble attachment
Benefits:
- Improved performance of ionically resistive elements
- Enhanced efficiency and functionality
- Reduction in maintenance and repair costs
Commercial Applications: The technology could have commercial applications in industries such as:
- Battery manufacturing
- Semiconductor production
- Medical device manufacturing
Questions about Gas Bubble Removal Technology: 1. How does the technology effectively remove gas bubbles from ionically resistive elements? 2. What are the potential cost savings associated with implementing this technology in industrial processes?
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Original Abstract Submitted
Provided is a technique that allows removing gas bubbles attached to a hole of an ionically resistive element.
