17802121. METAL MESH ARRAY AND MANUFACTURING METHOD THEREOF, THIN FILM SENSOR AND MANUFACTURING METHOD THEREOF simplified abstract (Beijing BOE Technology Development Co., Ltd.)

From WikiPatents
Jump to navigation Jump to search

METAL MESH ARRAY AND MANUFACTURING METHOD THEREOF, THIN FILM SENSOR AND MANUFACTURING METHOD THEREOF

Organization Name

Beijing BOE Technology Development Co., Ltd.

Inventor(s)

Kui Liang of Beijing (CN)

Feng Qu of Beijing (CN)

METAL MESH ARRAY AND MANUFACTURING METHOD THEREOF, THIN FILM SENSOR AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 17802121 titled 'METAL MESH ARRAY AND MANUFACTURING METHOD THEREOF, THIN FILM SENSOR AND MANUFACTURING METHOD THEREOF

The present disclosure introduces a metal mesh array and its manufacturing method, along with a thin film sensor and its manufacturing method, within the electronic device technology field. The method for manufacturing a metal mesh array involves providing a base substrate, forming a seed layer of a first metal on the base substrate, creating a first interlayer dielectric layer with groove structures on the seed layer, and electroplating to form metal lines in the groove structures, resulting in a metal mesh structure.

  • Seed layer of first metal formed on base substrate
  • Interlayer dielectric layer with groove structures created
  • Electroplating process to form metal lines in the groove structures
  • Metal lines arranged in intersecting manner in each working area
  • Formation of metal mesh structure

Potential Applications: - Touchscreens - Flexible electronics - Solar panels - Wearable technology - Printed electronics

Problems Solved: - Enhancing conductivity in electronic devices - Improving sensor sensitivity - Increasing durability of thin film sensors

Benefits: - Higher performance in electronic devices - Cost-effective manufacturing process - Versatile applications in various industries

Commercial Applications: Title: Advanced Metal Mesh Array Technology for Electronic Devices This technology can be utilized in the production of touchscreens, flexible electronics, solar panels, and wearable technology, offering improved conductivity and durability for a wide range of commercial applications.

Questions about Metal Mesh Array Technology: 1. How does the metal mesh array technology improve sensor sensitivity? The metal mesh array technology enhances sensor sensitivity by providing a more conductive and durable structure for thin film sensors, resulting in more accurate and reliable data collection.

2. What are the potential cost savings associated with using metal mesh arrays in electronic devices? Using metal mesh arrays in electronic devices can lead to cost savings due to the efficient manufacturing process and the improved performance of the devices, reducing the need for frequent replacements or repairs.


Original Abstract Submitted

The present disclosure provides a metal mesh array and a manufacturing method thereof, a thin film sensor and a manufacturing method thereof, and belongs to the field of electronic device technology. A method for manufacturing a metal mesh array includes: providing a base substrate; forming a first metal layer on the base substrate as a seed layer; forming a first interlayer dielectric layer on a side of the seed layer away from the base substrate such that the first interlayer dielectric layer includes first groove structures and second groove structures in working areas and arranged in an intersecting manner; and performing an electroplating process on the seed layer to form first metal lines in the first groove structures and second metal lines in the second groove structures. The first metal lines and second metal lines in each working area are arranged in an intersecting manner, thereby forming a metal mesh.