17794829. DISPLAY SUBSTRATE, DISPLAY MOTHERBOARD AND DISPLAY PANEL RELATED THERETO simplified abstract (BOE Technology Group Co., Ltd.)

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DISPLAY SUBSTRATE, DISPLAY MOTHERBOARD AND DISPLAY PANEL RELATED THERETO

Organization Name

BOE Technology Group Co., Ltd.

Inventor(s)

Zhijian Zhu of Beijing (CN)

Pengcheng Lu of Beijing (CN)

Junbo Wei of Beijing (CN)

Xiao Bai of Beijing (CN)

Jie Sun of Beijing (CN)

Yage Song of Beijing (CN)

Shengji Yang of Beijing (CN)

Xiaochuan Chen of Beijing (CN)

DISPLAY SUBSTRATE, DISPLAY MOTHERBOARD AND DISPLAY PANEL RELATED THERETO - A simplified explanation of the abstract

This abstract first appeared for US patent application 17794829 titled 'DISPLAY SUBSTRATE, DISPLAY MOTHERBOARD AND DISPLAY PANEL RELATED THERETO

The abstract describes a display substrate with a central region and a peripheral region, including a dielectric layer, a pad, and a conductive sealing part.

  • The display substrate has a central region and a peripheral region.
  • It includes a dielectric layer with first and second portions arranged in sequence.
  • A pad is located within the peripheral region on a surface of the second portion.
  • A conductive sealing part is located within the peripheral region and in the dielectric layer.
  • The conductive sealing part includes at least a first portion adjacent to the pad.

Potential Applications: - This technology can be used in the manufacturing of display panels for electronic devices. - It may find applications in the production of high-resolution screens for smartphones, tablets, and other gadgets.

Problems Solved: - The technology addresses the need for improved display substrates with enhanced functionality. - It provides a solution for ensuring proper connectivity and sealing in display panels.

Benefits: - Enhanced performance and durability of display panels. - Improved electrical connections and sealing capabilities. - Potential for higher resolution and quality in electronic displays.

Commercial Applications: Title: Advanced Display Substrate Technology for Electronic Devices This technology can be utilized in the production of smartphones, tablets, laptops, and other electronic devices with high-quality display panels. The market implications include improved product performance, increased consumer satisfaction, and potential for market differentiation.

Prior Art: Readers can explore prior patents related to display substrates, dielectric layers, and conductive sealing parts in electronic devices to understand the evolution of this technology.

Frequently Updated Research: Researchers are constantly working on enhancing display substrate technology to improve display quality, resolution, and durability in electronic devices.

Questions about Display Substrate Technology: 1. How does this technology compare to traditional display substrate designs? This technology offers improved connectivity and sealing capabilities compared to traditional designs, enhancing the overall performance of display panels.

2. What impact can this technology have on the consumer electronics market? This technology can lead to the production of electronic devices with higher resolution and durability, potentially influencing consumer preferences and market trends.


Original Abstract Submitted

Embodiments of the present disclosure provide a display substrate, a related display motherboard, and a related display panel. The display substrate has a central region and a peripheral region surrounding the central region. The display substrate includes a substrate, a dielectric layer located on the substrate and including a first portion and a second portion arranged in sequence in a direction perpendicular to the substrate, a pad located within the peripheral region and on a surface of the second portion on a side away from the substrate, and a conductive sealing part located within the peripheral region and in the dielectric layer, wherein the conductive sealing part includes at least a first portion adjacent to the pad in a direction parallel to the substrate, and wherein the first portion of the conductive sealing part is covered by the second portion of the dielectric layer.