17790347. Screen Module, Display Assembly, and Electronic Device simplified abstract (HONOR DEVICE CO., LTD.)

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Screen Module, Display Assembly, and Electronic Device

Organization Name

HONOR DEVICE CO., LTD.

Inventor(s)

Yan Lv of Shenzhen (CN)

Bin Yan of Shenzhen (CN)

Guotong Zhou of Shenzhen (CN)

Dong Ma of Shenzhen (CN)

Screen Module, Display Assembly, and Electronic Device - A simplified explanation of the abstract

This abstract first appeared for US patent application 17790347 titled 'Screen Module, Display Assembly, and Electronic Device

Simplified Explanation

The patent application describes a screen module with a bendable display panel that includes a support layer between two panel layers. The support layer is thicker near the bent region, and a portion of it overlaps with a display driver chip on the first panel layer. This design allows for reducing the overall thickness of the screen module to meet the user's requirements for a thinner electronic device.

  • Bendable display panel with support layer
  • Thicker support layer near bent region
  • Overlapping support layer portion with display driver chip
  • Reduction of screen module thickness for thinner electronic devices

Potential Applications

The technology described in this patent application could be applied in various electronic devices such as smartphones, tablets, laptops, and wearable devices that require bendable or flexible display panels.

Problems Solved

This technology solves the problem of achieving a thinner profile for electronic devices without compromising the structural integrity and functionality of the display panel.

Benefits

The benefits of this technology include the ability to create sleeker and more compact electronic devices with bendable display panels, providing a more user-friendly and aesthetically pleasing design.

Potential Commercial Applications

  • "Innovative Bendable Display Panel Technology for Thin Electronic Devices"

Possible Prior Art

There may be prior art related to bendable display panels and support layers in electronic devices, but specific examples are not provided in the patent application.

Unanswered Questions

How does this technology impact the durability of the display panel?

The patent application does not explicitly address the impact of the support layer design on the durability of the bendable display panel. Further testing and analysis would be needed to determine the durability of the screen module in real-world usage scenarios.

What materials are used in the support layer construction?

The patent application does not specify the materials used in the construction of the support layer. Understanding the materials and their properties could provide insights into the performance and longevity of the screen module.


Original Abstract Submitted

A screen module uses a bendable display panel including a first panel layer and a second panel layer. A support layer is located between the first panel layer and the second panel layer. The first panel layer and the second panel layer are connected by a bent region, and a thickness of the support layer close to the bent region is greater than a thickness of a first region of the support layer. A projection of the first region of the support layer on the first panel layer overlaps with a projection of a display driver chip on the first panel layer. After being stacked, the thickness of the screen module may be reduced to meet the user's requirement for a small thickness of an electronic device.