17789848. BACKPLANE AND METHOD FOR MANUFACTURING THE SAME, BACKLIGHT MODULE, AND DISPLAY APPARATUS simplified abstract (BOE Technology Group Co., Ltd.)

BACKPLANE AND METHOD FOR MANUFACTURING THE SAME, BACKLIGHT MODULE, AND DISPLAY APPARATUS

Organization Name

BOE Technology Group Co., Ltd.

Inventor(s)

Hai Tang of Beijing (CN)

Xiaolin Geng of Beijing (CN)

Liang Gao of Beijing (CN)

Shubai Zhang of Beijing (CN)

Jianwei Qin of Beijing (CN)

BACKPLANE AND METHOD FOR MANUFACTURING THE SAME, BACKLIGHT MODULE, AND DISPLAY APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17789848 titled 'BACKPLANE AND METHOD FOR MANUFACTURING THE SAME, BACKLIGHT MODULE, AND DISPLAY APPARATUS

Simplified Explanation

The abstract describes a backplane with a substrate, circuit structure layer, reflective layer, electronic devices, and encapsulation portions. The backplane includes conductive lines with specific linear extending portions and orthographic projections on the substrate.

• The backplane includes a substrate, circuit structure layer, reflective layer, electronic devices, and encapsulation portions.
• Each encapsulation portion covers an electronic device in the plurality of electronic devices.
• At least one conductive line includes specific linear extending portions connected sequentially.
• Orthographic projections of the conductive lines and encapsulation portions are located on the substrate in a specific manner.

Potential Applications

This technology could be applied in the manufacturing of electronic devices, such as displays, sensors, and communication devices.

Problems Solved

This technology helps in organizing and protecting electronic components within a backplane, ensuring efficient operation and longevity of the devices.

Benefits

The backplane design improves the functionality and reliability of electronic devices by providing a structured and protective environment for the components.

Potential Commercial Applications

The technology could be utilized in the production of smartphones, tablets, laptops, and other electronic gadgets for enhanced performance and durability.

Possible Prior Art

One possible prior art could be the use of traditional backplane designs in electronic devices, which may not offer the same level of organization and protection as the described technology.

How does this technology compare to existing backplane designs in terms of efficiency and reliability?

This article does not provide a direct comparison between the described technology and existing backplane designs in terms of efficiency and reliability.

What are the specific materials used in the construction of the backplane and how do they contribute to its performance?

The article does not mention the specific materials used in the construction of the backplane or how they contribute to its performance.

Original Abstract Submitted

A backplane includes a substrate, a circuit structure layer, a reflective layer, a plurality of electronic devices and a plurality of encapsulation portions. Each encapsulation portion covers an electronic device in the plurality of electronic devices. At least one first conductive line includes a first linear extending portion, a second linear extending portion and a third linear extending portion that are sequentially connected. Orthographic projections of the first linear extending portion, the second linear extending portion, the third linear extending portion and an encapsulation portion in the plurality of encapsulation portions on the substrate are respectively a first orthographic projection, a second orthographic projection, a third orthographic projection and a fourth orthographic projection. The first orthographic projection is located within the fourth orthographic projection, the second orthographic projection is partially overlapped with the fourth orthographic projection, and the third orthographic projection is located outside the fourth orthographic projection.