17789263. HIGH-THROUGHPUT TEST CHIP simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
Contents
HIGH-THROUGHPUT TEST CHIP
Organization Name
BOE TECHNOLOGY GROUP CO., LTD.
Inventor(s)
HIGH-THROUGHPUT TEST CHIP - A simplified explanation of the abstract
This abstract first appeared for US patent application 17789263 titled 'HIGH-THROUGHPUT TEST CHIP
Simplified Explanation:
The high-throughput test chip described in the patent application consists of a backplane, a cover plate, and a connector. The backplane and cover plate align to create multiple accommodation chambers where test chip units are placed. Each accommodation chamber has a liquid inlet and outlet. The connector includes pipelines with valve structures to control the connection and disconnection of the pipelines.
- Test chip units are aligned in accommodation chambers on the backplane facing the cover plate.
- Each accommodation chamber has a liquid inlet and outlet.
- The connector includes pipelines with valve structures to control connection/disconnection.
- Pipelines connect to the liquid outlets of the accommodation chambers.
- Pipeline groups are formed, with each group sharing the same sample liquid outlet.
Key Features and Innovation:
- Integration of test chip units in accommodation chambers for high-throughput testing.
- Liquid inlets and outlets in each accommodation chamber for sample flow.
- Valve structures in pipelines for controlled liquid flow.
- Pipeline groups for efficient sample distribution.
Potential Applications:
The technology can be used in various industries such as biotechnology, pharmaceuticals, and research laboratories for high-throughput testing and analysis.
Problems Solved:
The technology addresses the need for efficient and controlled liquid sample testing in high-throughput environments.
Benefits:
- Increased testing efficiency.
- Controlled liquid sample flow.
- Enhanced accuracy in sample analysis.
Commercial Applications:
Potential commercial applications include automated testing systems, research equipment, and laboratory instruments for high-throughput sample analysis.
Prior Art:
No specific information on prior art related to this technology is provided in the abstract.
Frequently Updated Research:
There is no information on frequently updated research relevant to this technology in the abstract.
Questions about High-Throughput Test Chip Technology:
Question 1: How does the valve structure in the pipelines contribute to the efficiency of liquid sample testing?
Question 2: What are the potential cost-saving implications of using this high-throughput test chip technology in research laboratories?
Original Abstract Submitted
A high-throughput test chip includes: a backplane, a cover plate and a connector. The backplane and the cover plate are aligned to form a plurality of accommodation chambers. Test chip units are disposed on one side of the backplane facing the cover plate, and each of the test chip units is located in the corresponding accommodation chamber. Each of the accommodation chambers is provided with a liquid inlet and a liquid outlet. The connector includes pipelines; each of the pipelines is provided with a valve structure configured to control connection or disconnection of the pipeline. In each pair of a pipeline and an accommodation chamber, an inlet of the pipeline communicates with the liquid outlet of the accommodation chamber; the pipelines form at least one pipeline group, each pipeline group at least includes two pipelines, and the pipelines in each pipeline group share the same sample liquid outlet.
